US12068718B2ActiveUtilityA1

Intelligent detection system

56
Assignee: NAT UNIV CHIN YI TECHNOLOGYPriority: Nov 30, 2022Filed: Nov 30, 2022Granted: Aug 20, 2024
Est. expiryNov 30, 2042(~16.4 yrs left)· nominal 20-yr term from priority
Inventors:Cheng-Yu Peng
G06T 7/0004G06T 2207/10032G06T 7/001H02S 50/15
56
PatentIndex Score
0
Cited by
3
References
10
Claims

Abstract

An intelligent detection system includes an image module, a target detection module, and a physical model processing module. The target detection module runs a scanning mode on the target object and controls the image module to capture target images of the target object with different physical properties under the scanning mode. The scanning mode is allowed to be based on luminescence or thermal radiation emitted by variation of time, voltage, current, or illumination. The physical model processing module receives the target images and carries out an image stacking process with each target image based on different physical properties, generating a detection result image through physical formula of electronic circuit in cooperation with a chromaticity coordinate diagram. The detection result image displays the accordingly formed image distribution, through which the physical model processing module obtains the functions, features, defect locations or identification results of defect locations of the target object.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. An intelligent detection system, comprising:
 an image module configured to capture an image of a to-be-tested object with different physical properties; 
 a target detection module coupled with the image module and connected with the to-be-tested object, the target detection module configured to carry out a scanning mode on the to-be-tested object and control the image module to capture a plurality of target images of the to-be-tested object under the scanning mode with different physical properties, wherein the scanning mode is based on luminescence or thermal radiation emitted by variation of time, voltage, current, or illumination; and 
 a physical model processing module coupled with the target detection module and configured to receive the target images, the physical model processing module carrying out an image stacking process with the target images based on different physical properties, and generating a detection result image through a physical formula in cooperation with a chromaticity coordinate diagram, the detection result image displaying an image distribution accordingly formed, the physical model processing module obtaining functions, features, defect locations or an identification result of defect locations of the to-be-tested object based on the detection result image. 
 
     
     
       2. The intelligent detection system of  claim 1 , wherein the target detection module is configured to carry out the image stacking process with the target images captured under an identical physical property, so as to generate a detection image with image gradient variation; the target detection module obtains an image area having larger variation gradient through the detection image analysis and identifies the image area as a defect location of the to-be-tested object. 
     
     
       3. The intelligent detection system of  claim 1 , wherein the image module is configured to photo shoot the to-be-tested object with one frequency spectrum selected from a group consisting of ultraviolet light, visible light, near infrared light, black body radiation heat, infrared light, microwave, and megahertz wave, so as to generate the image of the to-be-tested object  1  of different physical properties. 
     
     
       4. The intelligent detection system of  claim 3 , wherein the physical model processing module is configured to perform a process selected from a group consisting of image stacking, de-noising, segmentation, feature enhancement, feature extraction, identification analysis, and a combination thereof on each target image. 
     
     
       5. The intelligent detection system of  claim 3 , wherein the to-be-tested object has semiconductor, electrical nonlinear, or varying with time characteristics. 
     
     
       6. The intelligent detection system of  claim 3 , wherein the target detection module continuously or periodically carries out the scanning mode on the to-be-tested object. 
     
     
       7. The intelligent detection system of  claim 1 , wherein the physical formula is a circuit model formed of electronic components; the circuit model represents different physical properties according to characteristics of different electronic components; the circuit model is allowed to be an energy level physical model, electromagnetic physical model, thermodynamic physical model, or physical behavior model. 
     
     
       8. The intelligent detection system of  claim 7 , wherein the physical formula is an equivalent diode circuit or a semiconductor energy level diagram. 
     
     
       9. The intelligent detection system of  claim 1 , wherein the chromaticity coordinate diagram comprises a three-dimensional basis; the three-dimensional basis of the chromaticity coordinate diagram is configured to be divided into three different physical property parameters; the three-dimensional basis of the chromaticity coordinate diagram uses chromaticity coordinates of three different property parameters to identify the features, the defect locations, or the identification results of the defect locations of the to-be-tested object; alternatively, the three different property parameters are adjusted with different weights, and then marked on the chromaticity coordinates, so as to obtain the functions of the to-be-tested object according to different weights thereof. 
     
     
       10. The intelligent detection system of  claim 9 , wherein the coordinates of the chromaticity coordinate diagram define a color space through a mathematical mode, and an image processing method of the color space of the chromaticity coordinate diagram is selected from a group consisting of CIE XYZ, CIE RGB, YIQ, HSV, YUV, CMY, and HSI.

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