Lidar transmitter assembly

Abstract

The present disclosure relates to optical transmitter modules, lidar systems, and methods of their manufacture. An example optical transmitter module includes a transparent substrate and a plurality of wires disposed along the transparent substrate. The optical transmitter module includes driver circuitry electrically-coupled to at least a portion of the plurality of wires and one or more light-emitter devices electrically-coupled to at least a portion of the plurality of wires. The light-emitter device(s) are configured to emit light pulses. The optical transmitter module also includes a fast axis collimation lens disposed along the transparent substrate. The fast axis collimation lens is configured to collimate the light pulses so as to provide collimated light. The optical transmitter module also includes one or more waveguide structures disposed along the transparent substrate within an optical region. The optical transmitter module also includes a lid configured to provide a sealed interior volume.

What is claimed is: 
     
       1. An optical transmitter module, comprising:
 a transparent substrate; 
 a plurality of wires disposed along a first surface of the transparent substrate; 
 driver circuitry electrically-coupled to at least a portion of the plurality of wires; 
 one or more light-emitter devices electrically-coupled to at least a portion of the plurality of wires, wherein the one or more light-emitter devices are configured to emit light pulses; 
 a fast axis collimation lens disposed along the first surface, wherein the fast axis collimation lens is configured to collimate the light pulses so as to provide collimated light; 
 one or more waveguide structures disposed along the first surface of the transparent substrate within an optical region, wherein the one or more waveguide structures comprise respective reflective surfaces, wherein the one or more waveguide structures are configured to optically guide the collimated light toward the respective reflective surfaces so as to provide transmit light to an environment; 
 an aperture substrate comprising a plurality of optical apertures, wherein the aperture substrate is disposed proximate to the optical region; 
 a lid coupled to the transparent substrate and the aperture substrate, wherein the lid is configured to provide a sealed interior volume; and 
 at least one capacitor disposed between the lid and the driver circuitry. 
 
     
     
       2. The optical transmitter module of  claim 1 , wherein the plurality of wires comprise an electroplated conductive material. 
     
     
       3. The optical transmitter module of  claim 1 , further comprising a printed circuit board, wherein the printed circuit board is coupled to the driver circuitry and the one or more light-emitter devices by way of silver epoxy. 
     
     
       4. The optical transmitter module of  claim 1 , further comprising a thermal interface material (TIM) disposed between the lid and the at least one capacitor. 
     
     
       5. The optical transmitter module of  claim 1 , wherein the lid is coupled to the transparent substrate and the aperture substrate by an epoxy. 
     
     
       6. The optical transmitter module of  claim 1 , further comprising:
 a spring-spring interposer electrically-coupled to a portion of the wires. 
 
     
     
       7. The optical transmitter module of  claim 1 , further comprising:
 an anti-reflective (AR) window coupled proximate to an optical region of a second surface of the transparent substrate. 
 
     
     
       8. The optical transmitter module of  claim 7 , wherein the AR window is coupled to the transparent substrate by an epoxy. 
     
     
       9. The optical transmitter module of  claim 1 , further comprising:
 a desiccant material disposed within the sealed interior volume. 
 
     
     
       10. A lidar system comprising:
 an optical transmitter module comprising:
 a transparent substrate; 
 a plurality of wires disposed along a first surface of the transparent substrate; 
 driver circuitry electrically-coupled to at least a portion of the plurality of wires; 
 one or more light-emitter devices electrically-coupled to at least a portion of the plurality of wires, wherein the one or more light-emitter devices are configured to emit light pulses; 
 a fast axis collimation lens disposed along the first surface, wherein the fast axis collimation lens is configured to collimate the light pulses so as to provide collimated light; 
 one or more waveguide structures disposed along the first surface of the transparent substrate within an optical region, wherein the one or more waveguide structures comprise respective reflective surfaces, wherein the one or more waveguide structures are configured to optically guide the collimated light toward the respective reflective surfaces so as to provide transmit light to an environment; 
 an aperture substrate comprising one or more optical apertures, wherein the aperture substrate is disposed proximate to the optical region; 
 a lid coupled to the transparent substrate and the aperture substrate, wherein the lid is configured to provide a sealed interior volume; and 
 at least one capacitor disposed between the lid and the driver circuitry; and 
 
 an optical receiver module comprising:
 one or more detector devices configured to detect light received from the environment by way of the optical region of the transparent substrate and the one or more optical apertures. 
 
 
     
     
       11. The lidar system of  claim 10 , further comprising:
 a processor coupled to the optical transmitter module and the optical receiver module; 
 a housing; and 
 a vehicle coupled to the housing. 
 
     
     
       12. A method, comprising:
 coupling a fast axis collimation lens and one or more waveguide structures to a first surface of a transparent substrate; 
 forming a plurality of wires along the first surface; 
 bonding at least one light-emitter device and driver circuitry to the plurality of wires wherein the fast axis collimation lens is located between the at least one light-emitter device and the one or more waveguide structures; 
 patterning one or more optical apertures along a surface of an aperture substrate; 
 attaching the aperture substrate proximate to an optical region of the first surface; 
 forming at least one capacitor on the driver circuitry; and 
 attaching a lid to the transparent substrate and the aperture substrate, so as to form a sealed interior volume. 
 
     
     
       13. The method of  claim 12 , wherein forming the plurality of wires comprises:
 patterning the first surface with a lithography process according to a wire pattern; and 
 electroplating a conductive material according to the wire pattern so as to form the plurality of wires. 
 
     
     
       14. The method of  claim 12 , further comprising applying silver epoxy between the transparent substrate, light-emitter die, and driver circuitry. 
     
     
       15. The method of  claim 12 , wherein attaching the lid comprises:
 applying a thermal interface material (TIM) between the lid and the driver circuitry; and 
 applying epoxy between the lid and the transparent substrate and the aperture substrate. 
 
     
     
       16. The method of  claim 12 , further comprising:
 attaching a spring-spring interposer to the wires along the first surface. 
 
     
     
       17. The method of  claim 12 , further comprising:
 attaching an anti-reflective (AR) window proximate to an optical region of a second surface of the transparent substrate. 
 
     
     
       18. The method of  claim 17 , wherein attaching the AR window comprises applying an epoxy between the AR window and the transparent substrate. 
     
     
       19. The method of  claim 12 , further comprising:
 providing a desiccant material within the sealed interior volume. 
 
     
     
       20. The method of  claim 12 , further comprising:
 attaching an optical receiver module proximate to the lid, wherein the optical receiver module comprises at least one detector device configured to detect receive light from an environment by way of the optical region of the transparent substrate and the one or more optical apertures.