Assembly for a semiconductor photonic component

Abstract

The invention relates to an assembly ( 10 ) for a semiconductor photonic component ( 31, 32 ), wherein the semiconductor photonic component ( 31, 32 ) is accommodated in an assembly housing ( 11 ) being shielded from the environment. Furthermore, the invention relates to an assembly housing ( 11 ) for use with such assembly for a semiconductor photonic component ( 31, 32 ). Accordingly, the assembly ( 10 ) at least comprising a substrate ( 30 ); at least one semiconductor photonic component ( 31, 32 ) mounted to the substrate ( 30 ), said at least one semiconductor photonic component ( 31, 32 ) including a photonic active surface element ( 31 A, 32 A); an assembly housing ( 11 ) for shielding the substrate ( 30 ) and the at least one semiconductor photonic component ( 31, 32 ) from the environment; the assembly housing ( 11 ) comprises a housing wall part ( 20, 20 ) provided with at least one photonic window element ( 21 ) facing the photonic active surface element ( 31 A, 32 A) of the at least one semiconductor photonic component ( 31 ), said at least one photonic window element ( 21 ) forming a monolithic part with the housing wall part ( 20, 20 ′) and having a transmissivity being larger than the transmissivity of the housing wall part ( 20, 20 ′).

The invention claimed is: 
     
       1. An assembly for a semiconductor photonic component, the assembly at least comprising:
 a substrate; 
 at least one semiconductor photonic component mounted to the substrate, said at least one semiconductor photonic component including a photonic active surface element; 
 an assembly housing for shielding the substrate and the at least one semiconductor photonic component from the environment; 
 the assembly housing comprises a housing wall part having an exterior surface and being provided with at least one photonic window element facing the photonic active surface element of the at least one semiconductor photonic component, said at least one photonic window element being a bottom wall of a recess in said exterior surface and forming a monolithic part with the housing wall part, 
 wherein the at least one photonic window element has a thickness which is smaller than a thickness of the housing wall part for having a transmissivity being larger than the transmissivity of the housing wall part, the recess has a side wall at least partly formed by upright housing wall sections and has a depth D which is larger than the thickness T of the housing wall part, and 
 wherein the housing wall part contains a light absorbing dope and/or light blocking dope. 
 
     
     
       2. The assembly for a semiconductor photonic component according to  claim 1 , wherein the recess has a width W at the exterior surface and depth D, wherein D/W is such that only light rays can directly imping on the at least one photonic window at an angle smaller than a critical angle β critic , wherein β critic  <=40°, preferably <=25°, more preferably <=20°. 
     
     
       3. The assembly for a semiconductor photonic component according to  claim 1 , wherein the at least one photonic window element has a transmissivity of at least 10%, preferably between 10% and 30% and the housing wall part has a transmissivity of at the most 10%, preferably between 10% and 1%, in particular at the most of 3%. 
     
     
       4. The assembly for a semiconductor photonic component according to  claim 1 , wherein the housing wall part is made from a light transmissive plastic material, wherein the plastic material preferably is chosen from the group of polycarbonate, PMMA, polystyrene, styrene-acrylonitrile, polypropylene, silicone, polyurethane. 
     
     
       5. The assembly for a semiconductor photonic component according to  claim 1 , wherein the housing wall part is formed integrally with the assembly housing. 
     
     
       6. The assembly for a semiconductor photonic component according to  claim 5 , wherein the housing wall part and the assembly housing form a monolithic part. 
     
     
       7. The assembly for a semiconductor photonic component according to  claim 5 , wherein the housing wall part is formed as an insert element in the assembly housing. 
     
     
       8. The assembly according to  claim 1 , wherein the at least semiconductor photonic element comprises a light emitting element, in particular a LED and/or a light sensing element. 
     
     
       9. The assembly according to  claim 8 , wherein the light sensing element is a photodiode, a phototransistor, or a photovoltaic cell. 
     
     
       10. An assembly housing for use with an assembly for a semiconductor photonic component as defined in  claim 1 . 
     
     
       11. A housing wall part for use in an assembly housing as defined in  claim 1 . 
     
     
       12. A luminaire comprising an assembly for a semiconductor photonic component as defined in  claim 1 .