Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Abstract

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.

The invention claimed is: 
     
       1. A resin composition comprising:
 a maleimide compound (A), 
 a cyanate ester compound (B), and 
 a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000, 
 a block copolymer (D) comprising a styrene backbone, and 
 a styrene oligomer (E), 
 wherein 
 the polyphenylene ether compound (C) is represented by Formula (1): 
 
       
         
           
           
               
               
           
         
         in Formula (1), X represents an aryl group; —(Y—O)n 2 - represents a polyphenylene ether moiety; R 1 , R 2 , and R 3  each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n 2  represents an integer of from 1 to 100; n 1  represents an integer of from 1 to 6; and n 3  represents an integer of from 1 to 4, 
         a content of the polyphenylene ether compound (C) in the resin composition is not less than 5 parts by mass, and not more than 30 parts by mass, relative to 100 parts by mass of resin solid component of the resin composition, 
         the resin composition does not include phosphazene as a flame retardant, and 
         a total amount of a polyphenylene ether compound other than the polyphenylene ether compound (C) and an additional thermoplastic elastomer is not more than 3 mass %. 
       
     
     
       2. The resin composition according to  claim 1 , wherein the block copolymer (D) comprising a styrene backbone contains at least one selected from the group consisting of a styrene-butadiene block copolymer, a styrene-isoprene block copolymer, a styrene-hydrogenated butadiene block copolymer, a styrene-hydrogenated isoprene block copolymer, and a styrene-hydrogenated (isoprene/butadiene) block copolymer. 
     
     
       3. The resin composition according to  claim 1 , wherein the maleimide compound (A) contains at least one selected from the group consisting of Formulas (2), (3), (4), and (17): 
       
         
           
           
               
               
           
         
         in Formula (2), R 4 's each independently represent a hydrogen atom or a methyl group; and n 4  represents an integer of not less than 1; 
       
       
         
           
           
               
               
           
         
         in Formula (3), R 5 's each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbon atoms, or a phenyl group; and n 5  represents an integer of not less than 1 and not more than 10; 
       
       
         
           
           
               
               
           
         
         in Formula (4), R 6 's each independently represent a hydrogen atom, a methyl group, or an ethyl group; and R 7 's each independently represent a hydrogen atom or a methyl group; and 
       
       
         
           
           
               
               
           
         
         in Formula (17), R 8 's each independently represents a hydrogen atom, a methyl group, or an ethyl group. 
       
     
     
       4. The resin composition according to  claim 1 , further comprising a filler (F). 
     
     
       5. The resin composition according to  claim 4 , wherein a content of the filler (F) is from 50 to 300 parts by mass relative to 100 parts by mass of resin solid component. 
     
     
       6. The resin composition according to  claim 1 , further comprising a flame retardant (G). 
     
     
       7. The resin composition according to  claim 1 , wherein a content of the block copolymer (D) comprising a styrene backbone is from 1 to 50 parts by mass relative to 100 parts by mass of resin solid component. 
     
     
       8. The resin composition according to  claim 1 , wherein the polyphenylene ether compound (C) represented by Formula (1) is represented by Formula (11): 
       
         
           
           
               
               
           
         
         in Formula (11), X is an aromatic group selected from groups represented by Formula (12), Formula (13), and Formula (14); each —(Y—O) n2 — represents a polyphenylene ether moiety; and each n 2  represents an integer of from 1 to 100: 
       
       
         
           
           
               
               
           
         
         in Formula (13), R 38 , R 39 , R 40 , and R 41  each independently represent a hydrogen atom or a methyl group; and —B— is a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms; and 
       
       
         
           
           
               
               
           
         
         in Formula (14), —B— is a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms. 
       
     
     
       9. The resin composition according to  claim 1 , wherein the content of the polyphenylene ether compound (C) in the resin composition is not less than 8 parts by mass and not more than 25 parts by mass, relative to 100 parts by mass of resin solid component of the resin composition. 
     
     
       10. The resin composition according to  claim 1 , wherein the block copolymer (D) comprising a styrene backbone contains no random copolymer. 
     
     
       11. The resin composition according to  claim 1 , wherein the styrene oligomer (E) comprises a styrene polymer, a vinyl toluene polymer, an α-methylstyrene polymer, a vinyltoluene-α-methylstyrene polymer, or a styrene-α-styrene polymer. 
     
     
       12. The resin composition according to  claim 1 , wherein the total amount of the polyphenylene ether compound other than the polyphenylene ether compound (C) and the additional thermoplastic elastomer is not more than 1 mass %. 
     
     
       13. The resin composition according to  claim 1 , wherein the content of the polyphenylene ether compound (C) in the resin composition is not less than 8 parts by mass, and not more than 25 parts by mass, relative to 100 parts by mass of resin solid component of the resin composition. 
     
     
       14. A prepreg formed from a substrate and a resin composition described in  claim 1 . 
     
     
       15. A metal foil-clad laminate comprising one or more layered prepregs described in  claim 14 , and a metal foil disposed on one side or both sides of the layered prepregs. 
     
     
       16. A resin sheet comprising a support and a layer disposed on a surface of the support, the layer being formed from a resin composition described in  claim 1 . 
     
     
       17. A printed wiring board comprising an insulating layer and a conductor layer disposed on a surface of the insulating layer, wherein the insulating layer comprises a layer formed from a resin composition described in  claim 1 .