Photonic integrated circuit chip

Abstract

The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver. The interleaver further transfers the second optical signals to the different connection ports according to the different wavelengths of the second optical signals.

What is claimed is: 
     
       1. A photonic integrated circuit chip, comprising:
 a plurality of connection ports which are used to receive a plurality of first optical signals to the photonic integrated circuit chip; 
 multiple polarization beam splitting structures, wherein each polarization beam splitting structure is optically coupled to a corresponding connection port, and each polarization beam splitting structure is used to split a first optical signal passing through each polarization beam splitting structure into a first mode optical signal and a second mode optical signal; 
 a photodetector structure which comprises a first component and a second component, wherein the first component is optically coupled to a first polarization beam splitting structure, the second component is optical coupled to at least a second polarization beam splitting structure, the first component receives polarized optical signals split by the first polarization beam splitting structure, and the second component receives polarized optical signals split by the second polarization beam splitting structure; 
 an interleaver which is optically coupled to the second component and is used to transfer a first mode optical signal split by a third polarization beam splitting structure or a second mode optical signal split by the second polarization beam splitting structure to the second component of the photodetector structure; and 
 a modulator which is optically coupled to the interleaver and is used to transfer second optical signals with different wavelengths to the interleaver; 
 wherein the interleaver further transfers second optical signals to different connection ports corresponding to the second and third polarization beam splitting structures according to different wavelengths of the second optical signals. 
 
     
     
       2. The photonic integrated circuit chip of  claim 1 , further comprising a light source connection port which is optically coupled to the modulator and is used to be coupled to a light source. 
     
     
       3. The photonic integrated circuit chip of  claim 2 , wherein the light source is used to provide lights with different wavelengths to the modulator to form the second optical signals. 
     
     
       4. The photonic integrated circuit chip of  claim 1 , wherein the plurality of connection ports comprises:
 a first connection port which is coupled to a first optical fiber; 
 a second connection port which is coupled to a second optical fiber; 
 a third connection port which is coupled to a third optical fiber; and 
 a fourth connection port which is coupled to a fourth optical fiber. 
 
     
     
       5. The photonic integrated circuit chip of  claim 4 , wherein the first component and the second component are respectively positioned at two corresponding ends of the photodetector structure, and the first component is optically coupled to the first connection port, the second component is further optically coupled to the third connection port and the fourth connection port. 
     
     
       6. The photon integrated circuit chip of  claim 5 , wherein the first component has a 1×2 multimode interference optical coupling structure. 
     
     
       7. The photonic integrated circuit chip of  claim 5 , wherein the second component has a 1×3 multimode interference optical coupling structure. 
     
     
       8. The photonic integrated circuit chip of  claim 5 , wherein the multiple polarization beam splitting structures, the photodetector structure, the interleaver and the modulator are fabricated by a CMOS process. 
     
     
       9. The photonic integrated circuit chip of  claim 1 , wherein the interleaver has a wavelength division multiplexing structure. 
     
     
       10. The photonic integrated circuit chip of  claim 1 , further comprising multiple polarization rotator structures which are optically coupled to the multiple polarization beam splitting structures respectively and which each are used to rotate the first mode optical signal to have the same mode as the second mode optical signal. 
     
     
       11. A photonic integrated circuit chip, comprising:
 four optical fiber connection ports configured to be respectively coupled to four optical fibers to receive or transmit optical signals to the photonic integrated circuit chip; 
 one light source connection port configured to be coupled to a light source to transmit a light from the light source to the photonic integrated circuit chip; 
 multiple polarization beam splitting structures which are optically coupled to three of the four optical fibers via the optical fiber connection ports; 
 one photodetector structure which is optically coupled to the multiple polarization beam splitting structures; 
 an interleaver which is optically coupled to the photodetector structure; and 
 a modulator which is optically coupled to the interleaver and is optically coupled to the light source via the light source connection port. 
 
     
     
       12. The photonic integrated circuit chip of  claim 11 , further comprising multiple polarization rotating structures which are optically coupled to the multiple polarization beam splitting structures respectively. 
     
     
       13. The photonic integrated circuit chip of  claim 11 , wherein when the at least one photodetector structure comprises a first component and a second component, wherein the first component is optically coupled to a first polarization beam splitting structure, the second component is optical coupled to at least a second polarization beam splitting structure, the first component receives polarized optical signals split by the first polarization beam splitting structure, and the second component receives polarized optical signals split by the second polarization beam splitting structure. 
     
     
       14. The photonic integrated circuit chip according to  claim 13 , wherein the first and second components each have a one×multiple multimode interference optical coupling structure. 
     
     
       15. The photonic integrated circuit chip of  claim 11 , wherein the four optical fiber connection ports comprises two optical fiber connection ports which each are used to be coupled to corresponding optical fiber for bidirectional transference. 
     
     
       16. The photonic integrated circuit chip of  claim 15 , wherein the interleaver comprises at least three ports which are respectively used to receive an optical signal from one of the multiple polarization beam splitting structures, transmit the optical signal to the photodetector structure and receive an optical signal from the modulator. 
     
     
       17. A photonic integrated circuit chip, comprising:
 a connection port which is coupled to an optical fiber for bidirectional transference; 
 a polarization beam splitting structure which is optically coupled to the connection port, receives an optical receiving signal from the optical fiber via the connection port, and is used to split the optical receiving signal into a first mode optical receiving signal and a second mode optical receiving signal; 
 an interleaver which has a wavelength division multiplexing structure, is optically coupled to the polarization beam splitting structure, and receives the first mode optical receiving signal or the second mode optical receiving signal; and 
 a modulator which is optically coupled to the interleaver and transmits an optical transmitting signal to the interleaver, the optical transmitting signal and the first mode optical receiving signal or the second mode optical receiving signal received by the interleaver having different wavelengths and the same mode. 
 
     
     
       18. The photonic integrated circuit chip of  claim 17 , further comprising a polarization rotator structure which is optically coupled to the polarization beam splitting structure and is used to rotate the second mode optical receiving signal to have the same mode as the first mode optical receiving signal. 
     
     
       19. The photonic integrated circuit chip of  claim 17 , further comprising a light source which is optically coupled to the modulator and is used to provide lights with different wavelengths to the modulator to form the optical transmitting signals with the different wavelengths. 
     
     
       20. The photonic integrated circuit chip of  claim 17 , wherein the interleaver comprises three ports used to receive an optical signal from the polarization beam splitting structure, transmit the optical signal to a photodetector structure and receive an optical signal from the modulator.