Light emitting diode module and display device having the same

Abstract

Provided are a light emitting diode (LED) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. The LED module having a multi-layer structure includes substrate; a LED located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the LED and connected to the LED; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (FOG) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.

What is claimed is: 
     
       1. A light emitting diode (LED) module having a multi-layer structure, the LED module comprising:
 a substrate; 
 a LED on the substrate, the LED configured to emit light toward the substrate; 
 a plurality of upper electrodes on the LED and connected to the LED; 
 an upper insulating layer surrounding the plurality of upper electrodes; 
 a film on glass (FOG) electrode on the upper insulating layer; 
 a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer; 
 a metal capping layer provided between the FOG electrode and the fan out interconnection structure; and 
 a thin film transistor (TFT) provided on the substrate and having a gate electrode, 
 wherein a length of the FOG electrode extending in a first direction along an upper surface of the upper insulating layer is longer than a width of the FOG electrode extending in a second direction along the upper surface of the upper insulating layer, the second direction being perpendicular to the first direction, 
 wherein the plurality of upper electrodes comprise a first upper electrode connected to a signal electrode and a second upper electrode connected to the gate electrode, the signal electrode provided to supply a data signal to the LED, and 
 wherein the FOG electrode connects the first and the second upper electrodes respectively connected to the signal electrode and the gate electrode to be connected to the FOG electrode through the fan out interconnection structure. 
 
     
     
       2. The LED module of  claim 1 , wherein the upper insulating layer is formed of a first layer different from a second layer on which the LED is mounted. 
     
     
       3. The LED module of  claim 1 , wherein the upper insulating layer is provided between the FOG electrode and the LED to protect the LED. 
     
     
       4. The LED module of  claim 1 , wherein the upper insulating layer comprises via holes corresponding to the plurality of upper electrodes. 
     
     
       5. The LED module of  claim 1 , wherein the fan out interconnection structure is formed separate from an interconnection structure connected to the LED. 
     
     
       6. The LED module of  claim 1 , wherein the plurality of upper electrodes comprise a third upper electrode connected to a power voltage electrode that supplies power to the LED and a fourth upper electrode connected to a reference voltage electrode connected to a cathode of the LED,
 wherein the FOG electrode connects the third and the fourth upper electrodes respectively connected to the power voltage electrode and the reference voltage electrode to be connected to the FOG electrode through the fan out interconnection structure. 
 
     
     
       7. The LED module of  claim 6 , wherein the fan out interconnection structure respectively connected to the power voltage electrode and the reference voltage electrode form a symmetric structure with respect to the FOG electrode. 
     
     
       8. The LED module of  claim 1 , further comprises:
 another insulating layer provided on the upper insulating layer and the fan out interconnection structure. 
 
     
     
       9. A display device comprising:
 a light emitting diode (LED) module having a multi-layer structure; 
 a driver integrated chip (IC) configured to drive the LED module; 
 a film on glass (FOG) electrode located on the LED module and configured to be connected to the driver IC; and 
 a controller configured to supply power to the LED module through the driver IC, 
 wherein the LED module includes: 
 a substrate; 
 a LED on the substrate, the LED configured to emit light toward the substrate; 
 a plurality of upper electrodes on the LED and connected to the LED; 
 an upper insulating layer surrounding the plurality of upper electrodes; 
 a film on glass (FOG) electrode on the upper insulating layer; and 
 a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer. 
 
     
     
       10. The display device of  claim 9 , wherein the upper insulating layer is formed of a first layer different from a second layer on which the LED is mounted. 
     
     
       11. The display device of  claim 9 , wherein the upper insulating layer is provided between the FOG electrode and the LED to protect the LED. 
     
     
       12. The display device of  claim 9 , wherein the upper insulating layer comprises via holes corresponding to the plurality of upper electrodes. 
     
     
       13. The display device of  claim 9 , wherein the fan out interconnection structure is formed separate from an interconnection structure connected to the LED. 
     
     
       14. The display device of  claim 9 , further comprising a thin film transistor (TFT) disposed on the substrate and having a gate electrode,
 wherein the plurality of upper electrodes comprise a first upper electrode connected to a signal electrode and a second upper electrode connected to the gate electrode, the signal electrode provided to supply a data signal to the LED, and 
 wherein the FOG electrode connects the first and the second upper electrodes respectively connected to the signal electrode and the gate electrode to be connected to the FOG electrode through the fan out interconnection structure. 
 
     
     
       15. The display device of  claim 9 , wherein the plurality of upper electrodes comprise a third upper electrode connected to a power voltage electrode that supplies power to the LED and a fourth upper electrode connected to a reference voltage electrode connected to a cathode of the LED,
 wherein the FOG electrode connects the third and the fourth upper electrodes respectively connected to the power voltage electrode and the reference voltage electrode to be connected to the FOG electrode through the fan out interconnection structure. 
 
     
     
       16. The display device of  claim 15 , wherein the fan out interconnection structure respectively connected to the power voltage electrode and the reference voltage electrode form a symmetric structure with respect to the FOG electrode. 
     
     
       17. The display device of  claim 9 , wherein the fan out interconnection structure form a symmetric structure with respect to the FOG electrode,
 wherein the driver IC supplies power to the LED through the FOG electrode. 
 
     
     
       18. The display device of  claim 17 , wherein the plurality of upper electrodes comprise a third upper electrode connected to a power voltage electrode and a fourth upper electrode connected to a reference voltage electrode, and
 wherein the FOG electrode connects the third and the fourth upper electrodes respectively connected to the power voltage electrode and the reference voltage electrode to be connected to the FOG electrode through the fan out interconnection structure. 
 
     
     
       19. The display device of  claim 17 , wherein the driver IC supplies power to the LED in a substantially uniform manner through the fan out interconnection structure. 
     
     
       20. A light emitting diode (LED) module comprising:
 a substrate; 
 a first insulating layer on the substrate; 
 a light emitting diode (LED) on the first insulating layer; 
 a second insulating layer on the first insulating layer and surrounding the LED; 
 a plurality of upper electrodes on the second insulating layer and connected to the LED; 
 an upper insulating layer on the second insulating layer and surrounding the plurality of upper electrodes; 
 a third insulating layer on the upper insulating layer; 
 a film on glass (FOG) electrode on the third insulating layer; and 
 a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.