Photomask, display device, and manufacturing method thereof

Abstract

A photomask according to an exemplary embodiment includes: a mask substrate; and a first test pattern and a second test pattern disposed along a first edge of the mask substrate, wherein the first test pattern has a first outer shape and a first inner shape, the second test pattern has a second outer shape, and the second outer shape of the second test pattern is larger than the first inner shape of the first test pattern and smaller than the first outer shape of the first test pattern.

What is claimed is: 
     
       1. A manufacturing method of a display device comprising:
 forming a metal layer and a photoresist on a substrate; 
 aligning a photomask on the substrate and irradiating light onto the photomask; 
 repeating a process of shifting the photomask and irradiating the light onto the photomask; 
 forming a test resist pattern on the display device by developing the photoresist; 
 determining an alignment error of the photomask based on a shape of the test resist pattern, and repeating processes of forming, aligning, irradiating, shifting, and developing based on determination of the alignment error; and 
 etching the metal layer by using the photoresist as a mask, 
 wherein the test resist pattern includes: 
 a first test resist pattern, a second test resist pattern, and a third test resist pattern disposed along a first edge of the substrate, 
 the third test resist pattern is disposed between the first test resist pattern and the second test resist pattern, 
 the first test resist pattern has a first outer shape and a first inner shape, 
 the third test resist pattern has a third outer shape and a third inner shape, and 
 the second test resist pattern has a second outer shape. 
 
     
     
       2. The manufacturing method of  claim 1 , wherein:
 the second outer shape of the second test resist pattern is larger than the first inner shape of the first test resist pattern and is smaller than the first outer shape of the first test resist pattern. 
 
     
     
       3. The manufacturing method of  claim 2 , wherein:
 the third outer shape of the third test resist pattern is substantially the same as the second outer shape of the second test resist pattern, and 
 the third inner shape of the third test resist pattern is substantially the same as the first inner shape of the first test resist pattern. 
 
     
     
       4. The manufacturing method of  claim 3 , wherein:
 the substrate includes a plurality of markers disposed along the first edge of the substrate, and 
 each of the plurality of markers is disposed in the first test resist pattern, the second test resist pattern, and the third test resist pattern. 
 
     
     
       5. The manufacturing method of  claim 3 , wherein:
 each of the first outer shape of the first test resist pattern, the first inner shape of the first test resist pattern, the second outer shape of the second test resist pattern has a square shape, 
 a first length of one side of the second outer shape of the second test resist pattern is longer than a second length of one side of the first inner shape of the first test resist pattern and is shorter than a third length of one side of the first outer shape of the first test resist pattern. 
 
     
     
       6. The manufacturing method of  claim 3 , wherein:
 the second test resist pattern further has a second inner shape, and 
 the second inner shape of the second test resist pattern is smaller than the first inner shape of the first test resist pattern. 
 
     
     
       7. The manufacturing method of  claim 6 , wherein:
 each of the first outer shape of the first test resist pattern, the first inner shape of the first test resist pattern, the second outer shape of the second test resist pattern, and the second inner shape of the second test resist pattern has a square shape, 
 the second outer shape and the second inner shape of the second test resist pattern have a square shape, 
 a first length of one side of the second outer shape of the second test resist pattern is longer than a second length of one side of the first inner shape of the first test resist pattern and is shorter than a third length of one side of the first outer shape of the first test resist pattern, and 
 a fourth length of one side of the second inner shape of the second test resist pattern is shorter than the second length of one side of the first inner shape of the first test resist pattern. 
 
     
     
       8. The manufacturing method of  claim 3 , wherein etching the metal layer comprises:
 forming a first test metal pattern having substantially the same shape as the first test resist pattern, a second test metal pattern having substantially the same shape as the second test resist pattern, and a third test metal pattern having substantially the same shape as the third test resist pattern. 
 
     
     
       9. The manufacturing method of  claim 3 , wherein:
 the test resist pattern includes a plurality of third test resist patterns. 
 
     
     
       10. The manufacturing method of  claim 3 , wherein:
 a fourth test resist pattern, a fifth test resist pattern, and a sixth test resist pattern are disposed along a second edge facing the first edge of the substrate, 
 the sixth test resist pattern is disposed between the fourth test resist pattern and the fifth test resist pattern, 
 the fourth test resist pattern has substantially the same shape as the first test resist pattern, 
 the fifth test resist pattern has substantially the same shape as the second test resist pattern, and 
 the sixth test resist pattern has substantially the same shape as the third test resist pattern. 
 
     
     
       11. A display device comprising:
 a substrate; and 
 a first test metal pattern, a second test metal pattern, and a third test metal pattern disposed along a first edge of the substrate, 
 wherein the third test metal pattern is disposed between the first test metal pattern and the second test metal pattern, 
 wherein the first test metal pattern has a first outer shape and a first inner shape, 
 wherein the third test metal pattern has a third outer shape and a third inner shape, and 
 wherein the second test metal pattern has a second outer shape. 
 
     
     
       12. The display device of  claim 11 , wherein:
 the second outer shape of the second test metal pattern is larger than the first inner shape of the first test metal pattern and is smaller than the first outer shape of the first test metal pattern. 
 
     
     
       13. The display device of  claim 12 , wherein:
 the third outer shape of the third test metal pattern is substantially the same as the second outer shape of the second test metal pattern, and 
 the third inner shape of the third test metal pattern is substantially the same as the first inner shape of the first test metal pattern. 
 
     
     
       14. The display device of  claim 13 , wherein:
 the substrate includes a plurality of markers disposed along the first edge of the substrate, and 
 each of the plurality of markers is disposed in the first test metal pattern, the second test metal pattern, and the third test metal pattern. 
 
     
     
       15. The display device of  claim 13 , further comprising:
 a gate electrode disposed on the substrate; 
 a semiconductor overlapping the gate electrode; 
 a source electrode and a drain electrode disposed on the semiconductor and separated from each other; and 
 a pixel electrode connected to the drain electrode, 
 wherein the first test metal pattern, the second test metal pattern, and the third test metal pattern are disposed on the same layer as the source electrode, the drain electrode, or the pixel electrode.