Circuit board and electronic device including circuit board including a first and second plurality of ground patterns

Abstract

An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.

The invention claimed is: 
     
       1. An electronic device comprising:
 a first electric element and a second electric element; and 
 a circuit board configured to transmit a signal of a designated or selected frequency between the first electric element and the second electric element and including a first portion, a second portion, and a third portion, wherein the first portion is disposed between the second portion and the third portion, and wherein the circuit board comprises:
 a first layer and a second layer that extend between the second portion and the third portion; 
 at least one signal line disposed in the first layer and extending between the second portion and the third portion; 
 a plurality of first ground patterns disposed in the first layer and extending between the second portion and the third portion; 
 a plurality of second ground patterns disposed in the second layer and extending between the second portion and the third portion; 
 a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of first ground patterns to the plurality of second ground patterns; and 
 a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of first ground patterns to the plurality of second ground patterns, 
 wherein the plurality of first ground patterns include a first meander form at the first portion, and 
 wherein the first layer and the second layer face each other in a nonbonded state at the first portion. 
 
 
     
     
       2. The electronic device of  claim 1 , wherein:
 the first portion is flexible, and 
 the second and third portions are more rigid than the first portion. 
 
     
     
       3. The electronic device of  claim 1 , wherein the plurality of second ground patterns include a second meander form at the first portion disposed along the first meander form, and
 wherein the at least one signal line does not overlap the plurality of first ground patterns and the plurality of second ground patterns. 
 
     
     
       4. The electronic device of  claim 1 , wherein the circuit board further comprises:
 a first bonding layer that is positioned at the second portion and is made of an insulation material for coupling the first layer and the second layer; and 
 a second bonding layer that is positioned at the third portion and is made of an insulation material for coupling the first layer and the second layer. 
 
     
     
       5. The electronic device of  claim 1 , wherein:
 the first layer further comprises a first insulation layer on that the at least one signal line and the plurality of first ground patterns are disposed, 
 the second layer further comprises a second insulation layer on that the plurality of second ground patterns is disposed, and 
 the at least one signal line, the plurality of first ground patterns, and the plurality of second ground patterns are positioned between the first insulation layer and the second insulation layer. 
 
     
     
       6. The electronic device of  claim 5 , wherein the circuit board further comprises:
 a first nonconductive material that is included in the first layer and covers the plurality of first ground patterns; and 
 a second nonconductive material that is included in the second layer and covers the plurality of second ground patterns. 
 
     
     
       7. The electronic device of  claim 5 , wherein the first insulation layer and the second insulation layer includes dielectric constants different from each other. 
     
     
       8. The electronic device of  claim 5 , wherein:
 the first layer further comprises a third ground pattern that is positioned at the first insulation layer, 
 the first insulation layer is positioned between the plurality of first ground patterns and the third ground pattern, and 
 the third ground pattern overlaps the plurality of first ground patterns and the at least one signal line and is electrically connected to the plurality of first ground patterns and the plurality of second ground patterns through the plurality of first conductive vias and the plurality of second conductive vias. 
 
     
     
       9. The electronic device of  claim 8 , wherein:
 the second layer further comprises a plurality of fourth ground patterns that is disposed on the second insulation layer, 
 the second insulation layer is positioned between the plurality of second ground patterns and the plurality of fourth ground patterns, 
 the plurality of fourth ground patterns is electrically connected to the plurality of first ground patterns, the plurality of second ground patterns, and the third ground pattern through the plurality of first conductive vias and the plurality of second conductive vias, and 
 the plurality of fourth ground patterns include a third meander form disposed at the first portion along the first meander form. 
 
     
     
       10. The electronic device of  claim 9 , wherein:
 the second portion of the circuit board further comprises a third layer that is coupled to the second layer through an insulation material, 
 the third layer includes a fifth ground pattern and a third insulation layer between the fifth ground pattern and the second layer, and 
 the fifth ground pattern is electrically connected to the plurality of first ground patterns, the plurality of second ground patterns, the third ground pattern, and the plurality of fourth ground patterns through the plurality of first conductive vias. 
 
     
     
       11. The electronic device of  claim 10 , wherein:
 the third portion of the circuit board further comprises a fourth layer that is coupled to the second layer through an insulation material, 
 the fourth layer includes a sixth ground pattern and a fourth insulation layer between the sixth ground pattern and the second layer, 
 the sixth ground pattern is electrically connected to the plurality of first ground patterns, the plurality of second ground patterns, the third ground pattern, and the plurality of fourth ground patterns through the plurality of second conductive vias. 
 
     
     
       12. The electronic device of  claim 1 , wherein the designated or selected frequency includes 6-100 GHz. 
     
     
       13. The electronic device of  claim 1 , further comprising:
 a foldable housing that includes a first housing portion including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and a second housing portion including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction; and 
 a flexible display that extends from the first surface to the third surface, 
 wherein the circuit board is positioned in the foldable housing, 
 wherein the second portion is positioned at the first housing portion, 
 wherein the third portion is positioned at the second housing portion, and 
 wherein the first portion is positioned across the first housing portion and the second housing portion. 
 
     
     
       14. The electronic device of  claim 13 , wherein in a state where the foldable housing is folded, the first surface faces the third surface. 
     
     
       15. The electronic device of  claim 13 , wherein in a state where the foldable housing is folded, the second surface faces the fourth surface. 
     
     
       16. A circuit board comprising:
 a first portion, a second portion, and a third portion, wherein the first portion is disposed between the second portion and the third portion; 
 a first layer and a second layer that extend between the second portion and the third portion; 
 at least one signal line disposed in the first layer and extending between the second portion and the third portion; 
 a plurality of first ground patterns disposed in the first layer and extending between the second portion and the third portion; 
 a plurality of second ground patterns disposed in the second layer and extending between the second portion and the third portion; 
 a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of first ground patterns to the plurality of second ground patterns; and 
 a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of first ground patterns to the plurality of second ground patterns, 
 wherein the plurality of first ground patterns include a first meander form at the first portion, and 
 wherein the first layer and the second layer face each other in a nonbonded state at the first portion. 
 
     
     
       17. The circuit board of  claim 16 , wherein:
 the first portion is flexible, and 
 the second and third portions are more rigid than the first portion. 
 
     
     
       18. The circuit board of  claim 16 , wherein the plurality of second ground patterns include a second meander form at the first portion disposed along the first meander form, and wherein the at least one signal line does not overlap the plurality of first ground patterns and the plurality of second ground patterns. 
     
     
       19. The circuit board of  claim 16 , further comprising:
 a first bonding layer that is positioned at the second portion and is made of an insulation material for coupling the first layer and the second layer; and 
 a second bonding layer that is positioned at the third portion and is made of an insulation material for coupling the first layer and the second layer. 
 
     
     
       20. The circuit board of  claim 16 , wherein:
 the first layer further comprises a first insulation layer on that the at least one signal line and the plurality of first ground patterns are disposed, 
 the second layer further comprises a second insulation layer on that the plurality of second ground patterns is disposed, and 
 the at least one signal line, the plurality of first ground patterns, and the plurality of second ground patterns are positioned between the first insulation layer and the second insulation layer.