Method for producing a chip card, card body for a chip card, and chip card

Abstract

A method for producing a chip card, such that the chip card includes a card body and a chip module arranged thereon. The method has the steps of providing a card body; producing a cavity for receiving the chip module; producing at least one component opening for each of one or more electronic components in an overlap region, which is covered by the chip module arranged later; applying soldering material onto the electronic component(s), into the at least one component opening, and/or onto a lower face of the chip module; placing the electronic component(s) in the at least one component opening; introducing the chip module into the cavity; and heating the soldering material.

The invention claimed is: 
     
       1. A method for producing a chip card, the chip card comprising a card body and a chip module arranged thereon, having the steps:
 providing a card body; 
 excavating a cavity in order to receive the chip module; 
 excavating at least one component opening respectively for one or more power matching components in an overlap region and in a bottom face of the cavity such that the at least one component opening is covered by the subsequently arranged chip module, wherein the respective power matching component is a capacitor; 
 applying solder onto the power matching component or components, into the at least one component opening and/or a lower side of the chip module; 
 placing the power matching component or components in the at least one component opening; 
 introducing the chip module into the cavity; and 
 heating the solder. 
 
     
     
       2. The method according to  claim 1 , wherein the solder is applied on two opposite walls of the at least one component opening. 
     
     
       3. The method according to  claim 1 , wherein the power matching component or components are pre-fixed on the chip module with a resilient adhesive, and in that the steps of placement and introduction are carried out simultaneously. 
     
     
       4. The method according to  claim 1 , wherein the solder is heated by one or more heating dies and subsequently cooled. 
     
     
       5. A method for producing a chip card, the chip card comprising a card body and a chip module arranged thereon, having the steps:
 providing a card body; 
 excavating a cavity in order to receive the chip module; 
 excavating at least one component opening respectively for one or more power matching components in an overlap region and in a bottom face of the cavity such that the at least one component opening is covered by the subsequently arranged chip module wherein the respective power matching component is a capacitor; 
 applying electrically conductive bonder onto the power matching component or components, into the at least one component opening and/or a lower side of the chip module; 
 placing the power matching component or components in the at least one component opening; and 
 introducing the chip module into the cavity. 
 
     
     
       6. The method according to  claim 3 , wherein before the placement of the power matching component or components, a resilient medium is introduced into the at least one component opening. 
     
     
       7. The method according to  claim 1 , wherein a blind hole is excavated in the cavity for receiving a part of the chip module, and in that the chip module is introduced into the cavity and the blind hole. 
     
     
       8. A card body for a chip card, having a cavity configured to receive a chip module and having at least one component opening in a main face of the card body, respectively configured to receive one or more power matching components, the at least one component opening being arranged in an overlap region and in a bottom face of the cavity such that the at least one component opening is configured to be covered by the chip module that is subsequently arranged on the card body, wherein the respective power matching component is a capacitor. 
     
     
       9. The card body according to  claim 8 , wherein a blind hole configured to receive a part of the chip module is excavated in the cavity, and in that the overlap region is arranged between the blind hole and an edge of the cavity. 
     
     
       10. The card body according to  claim 8 , wherein the at least one component opening is formed separately from the blind hole. 
     
     
       11. A chip card having a card body according to  claim 8 , a chip module arranged on the chip card and at least one power matching component that is arranged in the at least one component opening.