Electronic device

Abstract

An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.

What is claimed is: 
     
       1. An electronic device, comprising:
 a circuit structure layer, comprising a circuit layer and a plurality of first conductive pads; 
 a package structure, disposed on the circuit structure layer; 
 an electronic element, embedded in the package structure and electrically connected to the circuit layer through the plurality of first conductive pads; 
 a plurality of function elements, wherein one of the plurality of function elements has a plurality of pads and a function unit, the function unit is electrically connected to the circuit structure layer through the plurality of pads, the plurality of pads are located between the function unit and the circuit structure layer, and in a top view of the electronic device, the function unit overlaps the plurality of pads; and 
 a protection layer, covering side surfaces of the plurality of function elements and completely covering a surface of the function unit away from the circuit structure layer, 
 wherein the circuit structure layer is disposed between the plurality of function elements and the electronic element, 
 wherein along a normal direction of the electronic element, a thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element, and a thickness of the protection layer is greater than a thickness of one of the plurality of function elements, 
 wherein the electronic element overlaps at least two function elements of the plurality of function elements, and the plurality of function elements arrange along a direction perpendicular to the normal direction of the electronic element. 
 
     
     
       2. The electronic device according to  claim 1 , wherein the package structure covers the electronic element and at least a portion of a first side of the circuit structure layer. 
     
     
       3. The electronic device according to  claim 1 , wherein the package structure comprises a single layer structure. 
     
     
       4. The electronic device according to  claim 1 , wherein the package structure comprises a molding material, and the molding material comprises an epoxy molding compound. 
     
     
       5. The electronic device according to  claim 1 , wherein the plurality of first conductive pads are located at a first side of the circuit structure layer, the circuit structure layer further comprises a plurality of second conductive pads located at a second side of the circuit structure layer, and the second side is opposite to the first side. 
     
     
       6. The electronic device according to  claim 5 , wherein the circuit structure layer further comprises a plurality of dielectric layers and a plurality of conductive vias penetrate through at least one dielectric layer, the plurality of first conductive pads are electrically connected to the plurality of second conductive pads through the plurality of conductive vias and the circuit layer. 
     
     
       7. The electronic device according to  claim 1 , wherein the package structure acts as a support base of the electronic device.