US12266741B2ActiveUtilityA1

Light emitting element, method of manufacturing the same, and display device including the light emitting element

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Assignee: SAMSUNG DISPLAY CO LTDPriority: Nov 19, 2020Filed: Apr 15, 2024Granted: Apr 1, 2025
Est. expiryNov 19, 2040(~14.4 yrs left)· nominal 20-yr term from priority
H10W 90/00H10H 20/034H10H 20/01335H10H 20/857H10H 20/0137H10H 20/018H10H 20/84H10H 20/819H10H 20/831H01L 2933/0025H01L 33/62H01L 33/0093H01L 33/0075H01L 33/007H01L 25/167H01L 25/0753H01L 33/44H10H 29/24
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Claims

Abstract

A light emitting element includes: a light emitting stack pattern including a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked along one direction; and an insulating film surrounding an outer surface of at least one of the first semiconductor layer, the active layer, and the second semiconductor layer. The insulating film including a zinc oxide (ZnO) thin film layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method of manufacturing a light emitting element, the method comprising:
 forming a light emitting stack structure by sequentially stacking a first semiconductor layer, an active layer, a second semiconductor layer, and an additional electrode on a substrate; 
 forming at least one light emitting stack pattern by etching the light emitting stack structure in a vertical direction, and exposing one region of the first semiconductor layer to the outside; 
 coating an insulating material layer made of a zinc acetate solution on the light emitting stack pattern by using a wet chemical process and drying the coated insulating material layer; 
 forming an insulating film surrounding an outer surface of the light emitting stack pattern by etching the dried insulating material layer in the vertical direction; and 
 forming the light emitting element by separating the light emitting stack pattern surrounded by the insulating film from the substrate. 
 
     
     
       2. The method of  claim 1 , wherein the insulating film is doped with at least one of Group III transition metals including yttrium (Y), scandium (Sc), lanthanum (La), actinium (Ac), lutetium (Lu), and lawrencium (Lr). 
     
     
       3. The method of  claim 1 , further comprising forming a protective film surrounding an outer surface of the insulating film, after the insulating film is formed,
 wherein the protective film comprises an inorganic material.

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