Fingerprint sensor package and smart card having the same

Abstract

A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

What is claimed is: 
     
       1. A fingerprint sensor package comprising:
 a first substrate including a core insulating layer including a first surface and an opposite second surface and a through-hole extending through the first and second surfaces, a first bonding pad disposed along a circumference of the through-hole on the second surface of the core insulating layer, and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad; 
 a second substrate in the through-hole of the core insulating layer and including a third surface and an opposite fourth surface, the second substrate including a plurality of first sensing patterns on the third surface, spaced apart in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; 
 a conductive support vertically overlapping the first substrate and the second substrate, supporting the first substrate and the second substrate below the first substrate and the second substrate, and electrically connecting the first bonding pad and the second bonding pad to each other; 
 a controller chip on the second substrate; and 
 a molding layer on the second surface of the core insulating layer, at least partially filling the through-hole between the first substrate and the second substrate, covering at least a portion of the second substrate and the first bonding pad, and spaced apart from the external connection pad. 
 
     
     
       2. The fingerprint sensor package of  claim 1 , wherein the conductive support is connected to each of the first bonding pad and the second bonding pad by a conductive member. 
     
     
       3. The fingerprint sensor package of  claim 2 , wherein the conductive member comprises at least one of a solder bump, silver epoxy, or an anisotropic conductive film (ACF). 
     
     
       4. The fingerprint sensor package of  claim 2 , wherein the conductive support has a groove portion on a surface contacting the conductive member to limit a position at which the conductive member is attached. 
     
     
       5. The fingerprint sensor package of  claim 1 , wherein the conductive support has a rectangular bar shape. 
     
     
       6. The fingerprint sensor package of  claim 1 , further comprising a dummy support adjacent the conductive support and connecting the first substrate and the second substrate to each other. 
     
     
       7. The fingerprint sensor package of  claim 6 , wherein the first substrate further comprises a first dummy bonding pad disposed along the circumference of the through-hole,
 the second substrate further comprises a second dummy bonding pad adjacent the second bonding pad, and 
 the dummy support is formed of the same material as the conductive support. 
 
     
     
       8. The fingerprint sensor package of  claim 7 , wherein at least one of the first dummy bonding pad and the second dummy bonding pad is electrically grounded. 
     
     
       9. The fingerprint sensor package of  claim 7 , wherein the dummy support is formed of a material having higher rigidity than the conductive support. 
     
     
       10. The fingerprint sensor package of  claim 7 , wherein the dummy support vertically overlaps the first substrate in each outer corner region of the second substrate. 
     
     
       11. The fingerprint sensor package of  claim 7 , wherein an area of the dummy support is larger than an area of the conductive support. 
     
     
       12. The fingerprint sensor package of  claim 1 , wherein the first substrate further comprises a ground bezel extending along a circumference of the through-hole on the first surface of the core insulating layer,
 wherein a horizontal distance between an edge of the first surface of the core insulating layer and the ground bezel is shorter than a horizontal distance between the edge of the first surface of the core insulating layer and the first bonding pad. 
 
     
     
       13. The fingerprint sensor package of  claim 1 , wherein the second substrate further comprises:
 a base layer; 
 a lower insulating layer on a lower surface of the base layer; and 
 an upper insulating layer on an upper surface of the base layer, 
 wherein the plurality of first sensing patterns are on the upper surface of the base layer, 
 the plurality of second sensing patterns are on an upper surface of the upper insulating layer, 
 the second bonding pad and the controller chip are on a lower surface of the lower insulating layer. 
 
     
     
       14. The fingerprint sensor package of  claim 13 , further comprising:
 an upper protective layer covering the upper surface of the upper insulating layer; and 
 a lower protective layer covering the lower surface of the lower insulating layer. 
 
     
     
       15. A fingerprint sensor package comprising:
 a first substrate including a core insulating layer including a first surface and an opposite second surface, the first substrate including a through-hole, a first bonding pad extending along a circumference of the through-hole on the second surface, and an external connection pad on an edge of the second surface; 
 a second substrate including a third surface including a sensing region and a peripheral region surrounding the sensing region and a fourth surface opposite to the third surface, and including a second bonding pad extending along an edge of the fourth surface; 
 a conductive support vertically overlapping the first substrate and the second substrate, supporting the first substrate and the second substrate below the first substrate and the second substrate, and electrically connecting the first bonding pad and the second bonding pad to each other; and 
 a controller chip on the fourth surface. 
 
     
     
       16. The fingerprint sensor package of  claim 15 , wherein the conductive support is connected to each of the first bonding pad and the second bonding pad by a conductive member,
 wherein the conductive member includes at least one of a solder bump, silver epoxy, and an anisotropic conductive film (ACF). 
 
     
     
       17. The fingerprint sensor package of  claim 15 , wherein the core insulating layer is a flexible film. 
     
     
       18. A smart card comprising:
 a card body including a groove region and a contact pad; 
 a security chip in the card body; and 
 a fingerprint sensor package configured to sense a user's fingerprint and transmit a signal for a sensing result to the security chip, 
 wherein the fingerprint sensor package includes: 
 a first substrate including a core insulating layer including a first surface and a second surface, opposite to each other, and having a substantially rectangular or square ring shape with a through-hole passing through the first and second surfaces, a first bonding pad disposed along a circumference of the through-hole on the second surface of the core insulating layer, and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad; 
 a second substrate in the through-hole of the core insulating layer and including a third surface and a fourth surface, opposite to each other, and including a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction, perpendicular to the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad; 
 a conductive support vertically overlapping the first substrate and the second substrate, supporting the first substrate and the second substrate below the first substrate and the second substrate, and electrically connecting the first bonding pad and the second bonding pad to each other; 
 a controller chip on the second substrate; and 
 a molding layer on the second surface of the core insulating layer, filling the through-hole between the first substrate and the second substrate, at least partially covering the second substrate and the first bonding pad, and spaced apart from the external connection pad. 
 
     
     
       19. The smart card of  claim 18 , wherein the first surface of the first substrate is coplanar with the third surface of the second substrate. 
     
     
       20. The smart card of  claim 18 , wherein the first substrate is a flexible PCB (FPCB), and
 the second substrate is a rigid type printed circuit board (PCB).