Circuit board structure for display device

Abstract

A circuit board structure for a display device includes a substrate, a bump, a protective layer, and a moisture-resistant layer. The substrate includes a first surface and a second surface opposite to the first surface. The bump is disposed on the first surface of the substrate and includes a first inorganic material. The protective layer is disposed on the first surface of the substrate. The protective layer includes an organic material and a first opening, in which the bump is positioned in the first opening. The moisture-resistant layer entirely covers the protective layer. The moisture-resistant layer includes a second inorganic material and a second opening, in which a portion of the bump is exposed in the second opening.

What is claimed is: 
     
       1. A circuit board structure for a display device, comprising:
 a substrate comprising a first surface and a second surface opposite to the first surface; 
 a bump disposed on the first surface of the substrate, wherein the bump comprises a first inorganic material; 
 a protective layer disposed on the first surface of the substrate, wherein the protective layer comprises an organic material and a first opening, and wherein the bump is positioned in the first opening; and 
 a moisture-resistant layer covering sidewalls of the protective layer in the first opening and an upper surface of the protective layer, wherein the moisture-resistant layer comprise a second inorganic material and a second opening, and wherein a portion of the bump is exposed in the second opening. 
 
     
     
       2. The circuit board structure for the display device of  claim 1 , wherein the moisture-resistant layer directly contacts the protective layer. 
     
     
       3. The circuit board structure for the display device of  claim 1 , wherein the moisture-resistant layer is conformally deposited on the protective layer and the bump. 
     
     
       4. The circuit board structure for the display device of  claim 1 , wherein a thickness of the protective layer is larger than a thickness of the bump. 
     
     
       5. The circuit board structure for the display device of  claim 1 , wherein a ratio of a thickness of the protective layer to a thickness of the bump is equal to or larger than 3. 
     
     
       6. The circuit board structure for the display device of  claim 1 , wherein a ratio of a distance between at least one side edge of the bump and the protective layer to a width of the bump is in a range of 1.5 to 2.0. 
     
     
       7. The circuit board structure for the display device of  claim 1 , further comprising:
 a circuit layer disposed on the second surface of the substrate. 
 
     
     
       8. The circuit board structure for the display device of  claim 1 , further comprising:
 a wire disposed on the first surface of the substrate, wherein the bump is connected to the wire, and the first inorganic material is a conductive material. 
 
     
     
       9. The circuit board structure for the display device of  claim 1 , further comprising:
 a wire disposed on the first surface of the substrate, wherein the bump and the wire are electrically isolated.