Module

Abstract

A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.

The invention claimed is: 
     
       1. A module comprising:
 a substrate having a first face; 
 a plurality of components mounted on the first face; 
 a resin film covering the plurality of components along contours of the plurality of components and also covering a part of the first face; and 
 a shield film provided to overlap the resin film, 
 wherein the first face is provided with a ground electrode, 
 the resin film has an opening, 
 the shield film is connected to the ground electrode via the opening, 
 the shield film has a dot-shaped recess corresponding to the opening, 
 the shield film is separated by a slit, and wherein the first face of the substrate is exposed to an outside of said module via said slit, and 
 the slit is provided in a region where a two-layer structure comprising the resin film and the shield film covers the first face of the substrate directly. 
 
     
     
       2. The module according to  claim 1 , wherein a distance between the shield film and a surface of each of the plurality of components is constant. 
     
     
       3. The module according to  claim 1 , wherein the module has a conductive material disposed in the opening of the resin film so as to cover a portion where the ground electrode and the shield film overlap. 
     
     
       4. The module according to  claim 1 , wherein the module has a conductive material interposed between the ground electrode and the shield film in the opening of the resin film. 
     
     
       5. The module according to  claim 1 , wherein the opening is located between the plurality of components. 
     
     
       6. The module according to  claim 1 , further comprising an antenna. 
     
     
       7. The module according to  claim 6 , wherein the substrate has a second face as a face opposite to the first face, and the antenna is disposed inside the substrate along the second face. 
     
     
       8. The module according to  claim 2 , wherein the module has a conductive material disposed in the opening of the resin film so as to cover a portion where the ground electrode and the shield film overlap. 
     
     
       9. The module according to  claim 2 , wherein the module has a conductive material interposed between the ground electrode and the shield film in the opening of the resin film. 
     
     
       10. The module according to  claim 2 , wherein the opening is located between the plurality of components. 
     
     
       11. The module according to  claim 3 , wherein the opening is located between the plurality of components. 
     
     
       12. The module according to  claim 4 , wherein the opening is located between the plurality of components. 
     
     
       13. The module according to  claim 2 , further comprising an antenna. 
     
     
       14. The module according to  claim 3 , further comprising an antenna. 
     
     
       15. The module according to  claim 4 , further comprising an antenna. 
     
     
       16. The module according to  claim 1 , wherein the ground electrode has a first surface, said first surface facing a same direction as said first face, wherein said resin contacts opposite, first and second end portions of the ground electrode at said first face, and wherein said shield film contacts an intermediate portion of the ground electrode, disposed between said first and second end portions, at said first face. 
     
     
       17. The module according to  claim 1 , wherein said ground electrode is a single element that extends between two adjacent components of said plurality of components. 
     
     
       18. The module according to  claim 17 , wherein the ground electrode has a first surface, said first surface facing a same direction as said first face, wherein said resin contacts opposite, first and second end portions of the ground electrode at said first face, and wherein said shield film contacts an intermediate portion of the ground electrode, disposed between said first and second end portions, at said first face. 
     
     
       19. The module according to  claim 1 , wherein said opening is defined by first and second portions having first and second widths, respectively, said first portion being positioned closer to the first face than the second portion, wherein said first width is smaller than said second width, and wherein said dot-shaped recess is located in the first portion.