Manufacturing method of light modulation device

Abstract

A method of manufacturing a light modulation device is disclosed herein. In some embodiments, a method comprises transferring a first substrate between a first unwind roll and a take-up roll, wherein an adhesive layer is disposed on the a first surface of the first substrate, transferring a second substrate between a second unwind roll and the take-up roll, wherein the second substrate includes a spacer and a liquid crystal alignment film formed on a first surface of the second substrate during the transfer and prior to an attachment with the adhesive layer of the first substrate, and attaching the first and second substrates via respective first surfaces thereof by passing the first and second substrates through an opening between adjacent attachment rolls to form a light modulation device.

The invention claimed is: 
     
       1. A method for manufacturing a light modulation device, comprising:
 transferring a first substrate between a first unwind roll and a take-up roll, wherein an adhesive layer is disposed on a first surface of the first substrate, wherein the adhesive layer comprises a cured product of a curable adhesive composition; 
 transferring a second substrate between a second unwind roll and the take-up roll, wherein the second substrate includes a spacer and a liquid crystal alignment film formed on a first surface of the second substrate during the transfer and prior to an attachment with the adhesive layer of the first substrate; 
 attaching the first and second substrates via respective first surfaces thereof by passing the first and second substrates through an opening between adjacent attachment rolls to form a light modulation device; and 
 heat-treating the first substrate before the attaching of the first and second substrates, 
 wherein the light modulation device comprises the first surface and the second substrate having the spacer, liquid crystal alignment film and the adhesive layer disposed therebetween, and wherein the spacer maintains a gap between the first and second substrates. 
 
     
     
       2. The method for manufacturing a light modulation device according to  claim 1 , wherein no liquid crystal alignment film is formed on the surface of the first substrate. 
     
     
       3. The method for manufacturing a light modulation device according to  claim 1 , wherein the first substrate further comprises a release film covering the adhesive layer prior to the attachment of the first and second substrates, and the method further comprises peeling the release film from the adhesive layer prior to the attachment of the first and second substrates. 
     
     
       4. The method for manufacturing a light modulation device according to  claim 1 , wherein the second substrate further comprises a protective film covering the first surface of the second substrate prior to forming the spacer and the liquid crystal alignment film on the first surface of the second substrate, and the method further comprises peeling the protective film from the first surface of the second substrate prior to forming the spacer and the liquid crystal alignment film on the first surface of the second substrate. 
     
     
       5. The method for manufacturing a light modulation device according to  claim 1 , further comprising supplying a sealant to an edge of the first surface of the second substrate before the attachment of the first and second substrates. 
     
     
       6. The method for manufacturing a light modulation device according to  claim 5 , further comprising supplying a liquid crystal compound to the first surface of the second substrate before the attachment of the first and second substrates. 
     
     
       7. The method for manufacturing a light modulation device according to  claim 5 , further comprising supplying a liquid crystal compound and a dichroic dye to the first surface of the second substrate before the attachment of the first and second substrates. 
     
     
       8. The method for manufacturing a light modulation device according to  claim 5 , further comprising supplying a liquid crystal compound and a chiral dopant to the first surface of the second substrate before the attachment of the first and second substrates. 
     
     
       9. The method for manufacturing a light modulation device according to  claim 8 , wherein the first and second substrates are attached such that a ratio of a distance (d) between the first and second substrates to a chiral pitch (p) formed by the chiral dopant is less than 1. 
     
     
       10. The method for manufacturing a light modulation device according to  claim 1 , wherein the spacer is a partition wall spacer. 
     
     
       11. The method for manufacturing a light modulation device according to  claim 1 , wherein the heat treatment is performed at a temperature of 80° C. or more for 30 seconds or more. 
     
     
       12. A method for manufacturing a light modulation device, comprising:
 transferring a first substrate between a first unwind roll and a take-up roll, wherein an adhesive layer is disposed on a first surface of the first substrate, wherein the adhesive layer comprises a cured product of a curable adhesive composition; 
 transferring a second substrate between a second unwind roll and the take-up roll, wherein the second substrate includes a spacer and a liquid crystal alignment film formed on a first surface of the second substrate during the transfer and prior to an attachment with the adhesive layer of the first substrate; and 
 attaching the first and second substrates via respective first surfaces thereof by passing the first and second substrates through an opening between adjacent attachment rolls to form a light modulation device, 
 wherein the attachment of the first and second substrates is performed within a temperature range of more than 50° C. and less than 90° C., and 
 wherein the light modulation device comprises the first surface and the second substrate having the spacer, liquid crystal alignment film and the adhesive layer disposed therebetween, and wherein the spacer maintains a gap between the first and second substrates. 
 
     
     
       13. A method for manufacturing a light modulation device, comprising:
 transferring a first substrate between a first unwind roll and a take-up roll, wherein an adhesive layer is disposed on a first surface of the first substrate, wherein the adhesive layer comprises a cured product of a curable adhesive composition; 
 transferring a second substrate between a second unwind roll and the take-up roll, wherein the second substrate includes a spacer and a liquid crystal alignment film formed on a first surface of the second substrate during the transfer and prior to an attachment with the adhesive layer of the first substrate; 
 attaching the first and second substrates via respective first surfaces thereof by passing the first and second substrates through an opening between adjacent attachment rolls to form a light modulation device; and 
 heat-treating the light modulation device after the attachment of the first and second substrates, 
 wherein the light modulation device comprises the first surface and the second substrate having the spacer, liquid crystal alignment film and the adhesive layer disposed therebetween, and wherein the spacer maintains a gap between the first and second substrates. 
 
     
     
       14. The method for manufacturing a light modulation device according to  claim 13 , wherein the heat treatment is performed at a temperature of 80° C. or more for 30 seconds or more.