Device for mass transfer of mini light-emitting diodes (mini-LEDs) based on array water jet-based ejection

Abstract

A device for mass transfer of Mini-LEDs based on array water jet-based ejection, including a planar motion platform, a vision camera, an array water jet-type ejection unit, a Z-axis motion platform, a blue membrane, an operation platform and a transfer substrate. The vision camera and the array water jet-type ejection unit are provided on a side of the planar motion platform. The array water jet-type ejection unit includes a water jet channel and a through-hole array. The Z-axis motion platform is provided at a side of the planar motion platform near the vision camera, and is configured for placement of the blue membrane. Multiple Mini-LED chips are bonded to the blue membrane. The operation platform is spacedly provided at a side of the Z-axis motion platform away from the planar motion platform.

What is claimed is: 
     
       1. A device for mass transfer of mini light-emitting diodes (Mini-LEDs) based on array water jet-based ejection, comprising:
 a planar motion platform operating on an X-Y plane; 
 a vision camera; 
 an array water jet-type ejection unit; 
 a Z-axis motion platform; 
 a blue membrane; 
 an operation platform; and 
 a transfer substrate; 
 wherein the vision camera and the array water jet-type ejection unit are provided on a side of the planar motion platform; 
 the array water jet-type ejection unit comprises a water jet channel and a through-hole array; 
 the Z-axis motion platform is provided at the side of the planar motion platform where the vision camera is provided, and is spaced from the planar motion platform; and the Z-axis motion platform is configured for placement of the blue membrane; 
 a plurality of Mini-LED chips uniformly distributed are bonded to a surface of the blue membrane; 
 the operation platform is spacedly provided at a side of the Z-axis motion platform away from the planar motion platform; and 
 the transfer substrate is fixedly provided on a side of the operation platform near the Z-axis motion platform. 
 
     
     
       2. The device of  claim 1 , wherein the transfer substrate is a glass substrate or a printed circuit board (PCB) substrate. 
     
     
       3. The device of  claim 2 , wherein in a case where the transfer substrate is the glass substrate, a surface of a side of the transfer substrate near the blue membrane is provided with a double-sided adhesive tape; and
 in a case where the transfer substrate is the PCB substrate, the surface of the side of the transfer substrate near the blue membrane is provided with a solder paste. 
 
     
     
       4. The device of  claim 1 , wherein a spacing between adjacent through-holes in the through-hole array is a positive integer multiple of a spacing between adjacent Mini-LED chips among the plurality of Mini-LED chips. 
     
     
       5. The device of  claim 1 , wherein a diameter of individual through-holes in the through-hole array is less than or equal to a length of a shortest side of each of the plurality of Mini-LED chips in contact with the surface of the blue membrane. 
     
     
       6. The device of  claim 1 , wherein a geometric size of each of the plurality of Mini-LED chips is 50-200 μm. 
     
     
       7. The device of  claim 1 , wherein a thickness of the blue membrane is 70-75 μm.