Ferrule polishing material

Abstract

Provided is a ferrule polishing material suitable for polishing a ferrule. A ferrule polishing material of the present invention solving the above object includes a binder formed from a resin material and abrasive grains dispersed in the binder. The resin material is formed from an epoxy resin. The abrasive grains are contained in an amount of not less than 80% and not greater than 91% with respect to the sum of masses of the abrasive grains and the binder, include small-diameter particles being particles having a particle diameter of not greater than 100 nm, the small-diameter particles being present in an amount of not less than 62.5% and not greater than 80% with respect to the mass of the abrasive grains, and are formed from silica.

The invention claimed is: 
     
       1. A ferrule polishing material comprising:
 a binder comprising a resin material; and 
 abrasive grains dispersed in the binder, wherein 
 the resin material is all crosslinked, and comprises a biphenyl epoxy resin which is a resin obtained by reacting an epoxy resin precursor having a biphenyl skeleton, and 
 the abrasive grains
 are contained in an amount of not less than 80% and not greater than 91% with respect to a sum of masses of the abrasive grains and the binder, 
 include small-diameter particles being particles having a particle diameter of not greater than 100 nm, the small-diameter particles being present in an amount of not less than 62.5% and not greater than 80% with respect to the mass of the abrasive grains, and 
 comprise silica. 
 
 
     
     
       2. The ferrule polishing material according to  claim 1 , wherein
 the resin material comprises an epoxy resin in an amount of not less than 93% with respect to a mass of the resin material. 
 
     
     
       3. The ferrule polishing material according to  claim 1 , wherein
 the binder has a pencil hardness of not less than 3H. 
 
     
     
       4. The ferrule polishing material according to  claim 1 , wherein
 the small-diameter particles are particles having a peak top particle diameter of not greater than 50 nm. 
 
     
     
       5. The ferrule polishing material according to  claim 1 , wherein
 the abrasive grains comprise particles having a peak top particle diameter of not less than 150 nm. 
 
     
     
       6. The ferrule polishing material according to  claim 1 , wherein
 the resin material comprises an epoxy resin in an amount of not less than 93% with respect to a mass of the resin material, 
 the binder has a pencil hardness of not less than 3H, 
 the small-diameter particles are particles having a peak top particle diameter of not greater than 50 nm, and, 
 the abrasive grains comprise particles having a peak top particle diameter of not less than 150 nm. 
 
     
     
       7. The ferrule polishing material according to  claim 1 , wherein
 the abrasive grains are contained in the amount of not less than 85% and not greater than 90% with respect to the sum of masses of the abrasive grains and the binder. 
 
     
     
       8. The ferrule polishing material according to  claim 1 , wherein
 the abrasive grains are contained in the amount of not less than 86% and not greater than 89% with respect to the sum of masses of the abrasive grains and the binder. 
 
     
     
       9. The ferrule polishing material according to  claim 1 , wherein the small-diameter particles are present in the amount of not less than 65% and not greater than 79% with respect to the mass of the abrasive grains. 
     
     
       10. The ferrule polishing material according to  claim 1 , wherein the small-diameter particles are present in the amount of not less than 70% and not greater than 78% with respect to the mass of the abrasive grains.