Light emitting module and method for manufacturing light emitting module

Abstract

A method for manufacturing a light emitting module includes: providing an intermediate body including: a wiring substrate including a metal layer, a first conductive member, and a second conductive member; disposing a resist layer on the intermediate body; disposing a light-emitting element on the resist layer, the light-emitting element comprising: a first electrode, and a second electrode; forming on the metal layer: a first bonding member in contact with the first conductive member and the first electrode, and a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and removing the resist layer.

What is claimed is: 
     
       1. A method for manufacturing a light emitting module, the method comprising:
 providing an intermediate body comprising:
 a wiring substrate comprising a metal layer located at an upper surface of the wiring substrate, 
 a first conductive member located on and in contact with the metal layer, and 
 a second conductive member separated from the first conductive member and located on and in contact with the metal layer; 
 
 disposing a resist layer on the intermediate body such that at least a portion of the resist layer is located between the first conductive member and the second conductive member; 
 disposing a light-emitting element on the resist layer such that a lower surface of the light-emitting element faces the upper surface of the wiring substrate, the light-emitting element comprising:
 a first electrode located at the lower surface of the light-emitting element, and 
 a second electrode disposed at the lower surface of the light-emitting element; 
 
 forming on the metal layer:
 a first bonding member in contact with the first conductive member and the first electrode, and 
 a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and 
 
 subsequent to the step of forming the first bonding member and the second bonding member, removing the resist layer. 
 
     
     
       2. The method for manufacturing the light emitting module, according to  claim 1 , further comprising:
 subsequent to the step of removing the resist layer, separating the metal layer into a first metal layer in contact with the first conductive member and the first bonding member, and a second metal layer in contact with the second conductive member and the second bonding member, the separating comprising selectively removing the metal layer using the first bonding member and the second bonding member as masks. 
 
     
     
       3. The method for manufacturing the light emitting module, according to  claim 1 , wherein:
 the first bonding member and the second bonding member are formed by electrolytic plating. 
 
     
     
       4. The method for manufacturing the light emitting module, according to  claim 1 , wherein:
 the step of providing the intermediate body comprises:
 providing the wiring substrate, and 
 disposing the first conductive member and the second conductive member on the metal layer. 
 
 
     
     
       5. The method for manufacturing the light emitting module, according to  claim 4 , wherein:
 the first conductive member and the second conductive member are formed by plating, sputtering, or vapor deposition. 
 
     
     
       6. The method for manufacturing the light emitting module, according to  claim 1 , wherein:
 the lower surface of the light-emitting element has a rectangular shape, and 
 in the step of disposing the light-emitting element, two opposite sides of outer edges of the lower surface of the light-emitting element are in contact with the resist layer. 
 
     
     
       7. The method for manufacturing the light emitting module, according to  claim 1 , wherein:
 in the step of providing the intermediate body:
 the wiring substrate has a first recessed portion and a second recessed portion at the upper surface of the metal layer, 
 the first conductive member is disposed in the first recessed portion, 
 the second conductive member is disposed in the second recessed portion, 
 a thickness of the first conductive member is greater than a depth of the first recessed portion, and 
 a thickness of the second conductive member is greater than a depth of the second recessed portion. 
 
 
     
     
       8. The method for manufacturing the light emitting module, according to  claim 1 , wherein:
 in the step of disposing the light-emitting element on the resist layer, the resist layer is not in contact with the first electrode and the second electrode of the light-emitting element. 
 
     
     
       9. A light emitting module comprising:
 a wiring substrate comprising:
 a first metal layer located at an upper surface of the wiring substrate, wherein an upper surface of the first metal layer has a first recessed portion, and 
 a second metal layer located at the upper surface of the wiring substrate, wherein an upper surface of the second metal layer has a second recessed portion; 
 
 a first conductive member located on and in contact with the first metal layer, wherein the first conductive member is disposed in the first recessed portion, and a thickness of the first conductive member is greater than a depth of the first recessed portion; 
 a second conductive member located on and in contact with the second metal layer, wherein the second conductive member is disposed in the second recessed portion, and a thickness of the second conductive member is greater than a depth of the second recessed portion; 
 a first bonding member located on the first metal layer, covering the first conductive member, and in contact with the first metal layer and the first conductive member; 
 a second bonding member located on the second metal layer, covering the second conductive member, and in contact with the second metal layer and the second conductive member; 
 a first metal film covering a surface of the first bonding member; 
 a second metal film covering a surface of the second bonding member; and 
 a light-emitting element having a lower surface that faces the upper surface of the wiring substrate, the light-emitting element comprising:
 a first electrode located at the lower surface of the light-emitting element and in contact with the first bonding member, and 
 a second electrode located at the lower surface of the light-emitting element and in contact with the second bonding member. 
 
 
     
     
       10. The light emitting module according to  claim 9 , wherein:
 the first bonding member is in contact with the upper surface of the first metal layer and a side surface and an upper surface of the first conductive member, and 
 the second bonding member is in contact with the upper surface of the second metal layer and a side surface and an upper surface of the second conductive member. 
 
     
     
       11. A method for manufacturing a light emitting module, the method comprising:
 providing an intermediate body comprising:
 a wiring substrate comprising a metal layer located at an upper surface of the wiring substrate, 
 a first conductive member located on and in contact with the metal layer, and 
 a second conductive member separated from the first conductive member and located on and in contact with the metal layer; 
 
 disposing a resist layer on the intermediate body such that at least a portion of the resist layer is located between the first conductive member and the second conductive member, wherein the resist layer is not in contact with the first conductive member and the second conductive member; 
 disposing a light-emitting element on the resist layer such that a lower surface of the light-emitting element faces the upper surface of the wiring substrate, the light-emitting element comprising:
 a first electrode located at the lower surface of the light-emitting element, and 
 a second electrode disposed at the lower surface of the light-emitting element; 
 
 forming on the metal layer:
 a first bonding member in contact with the first conductive member and the first electrode, and 
 a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and 
 
 removing the resist layer. 
 
     
     
       12. The method for manufacturing the light emitting module, according to  claim 11 , further comprising:
 subsequent to the step of removing the resist layer, separating the metal layer into a first metal layer in contact with the first conductive member and the first bonding member, and a second metal layer in contact with the second conductive member and the second bonding member, the separating comprising selectively removing the metal layer using the first bonding member and the second bonding member as masks. 
 
     
     
       13. The method for manufacturing the light emitting module, according to  claim 11 , wherein:
 the first bonding member and the second bonding member are formed by electrolytic plating. 
 
     
     
       14. The method for manufacturing the light emitting module, according to  claim 11 , wherein:
 the step of providing the intermediate body comprises:
 providing the wiring substrate, and 
 disposing the first conductive member and the second conductive member on the metal layer. 
 
 
     
     
       15. The method for manufacturing the light emitting module, according to  claim 14 , wherein:
 the first conductive member and the second conductive member are formed by plating, sputtering, or vapor deposition. 
 
     
     
       16. The method for manufacturing the light emitting module, according to  claim 11 , wherein:
 the lower surface of the light-emitting element has a rectangular shape, and 
 in the step of disposing the light-emitting element, two opposite sides of outer edges of the lower surface of the light-emitting element are in contact with the resist layer. 
 
     
     
       17. The method for manufacturing the light emitting module, according to  claim 11 , wherein:
 in the step of providing the intermediate body:
 the wiring substrate has a first recessed portion and a second recessed portion at the upper surface of the metal layer, 
 the first conductive member is disposed in the first recessed portion, 
 the second conductive member is disposed in the second recessed portion, 
 a thickness of the first conductive member is greater than a depth of the first recessed portion, and 
 a thickness of the second conductive member is greater than a depth of the second recessed portion. 
 
 
     
     
       18. The method for manufacturing the light emitting module, according to  claim 11 , wherein:
 in the step of disposing the light-emitting element on the resist layer, the resist layer is not in contact with the first electrode and the second electrode of the light-emitting element.