Machining device with a measuring system

Abstract

A machining device is provided with multiple translational and/or rotary machine axes for laser processing, grinding or electrical discharge machining of a workpiece into a tool. The machining device includes a machining unit comprising either a laser system with an optical system for generating, directing and/or moving a laser beam along an optical axis, a grinding tool rotatable around a tool axis, or an electrode tool for generating electrical discharge. The machining device also includes a workpiece support on which the workpiece is attached. The workpiece support is arranged movable about a second rotary machine axis, which is movable relative to a first rotary machine axis, perpendicular to the second rotary machine axis. A measuring system is positioned in a center of the first rotary machine axis and orientated towards a machine zero point defined by an intersection of the first rotary machine axis and the second rotary machine axis. The measurement system is configured to perform measurements along a first measurement axis and/or a second measurement axis to determine measurement data. A control unit is configured to control the machining unit and/or the measuring system.

The invention claimed is: 
     
       1. A machining device with multiple translational and/or rotary machine axes for laser processing, grinding or electrical discharge machining of a workpiece into a tool, the machining device comprising:
 a machining unit comprising either a laser system with an optical system for generating, directing and/or moving a laser beam along an optical axis, a grinding tool rotatable around a tool axis, or an electrode tool for generating electrical discharge, 
 a workpiece support on which the workpiece is attached, and wherein the workpiece support is arranged movable about a second rotary machine axis, which second rotary machine axis is movable relative to a first rotary machine axis perpendicular to the second rotary machine axis, and 
 a measuring system positioned in a center of the first rotary machine axis and orientated towards a machine zero point defined by an intersection of the first rotary machine axis and the second rotary machine axis, wherein the measuring system is configured to perform measurements along a first measurement axis and/or a second measurement axis to determine measurement data. 
 
     
     
       2. The machining device according to  claim 1 , wherein the measuring system comprises:
 a probe with a measuring tip movable in a measuring position, a rest position and/or a reference position, 
 a first linear axis arranged coaxial to the first rotary machine axis and a second linear axis, perpendicular to the first linear axis, wherein the first linear axis and the second linear axis are configured to move the probe along the first measurement axis and the second measurement axis, respectively and 
 a positioning system to detect the position of the measuring tip. 
 
     
     
       3. The machining device according to  claim 2 , wherein the movement of the probe along the first linear axis and/or second linear axis is force controlled. 
     
     
       4. The machining device according to  claim 3 , wherein the force control along the first linear axis and/or the second linear axis is based on determined data such as probing force, increase of probing force and/or velocity of probing force increase, wherein a threshold value is predeterminable. 
     
     
       5. The machining device according to  claim 2 , wherein the probe is configured as a touch trigger probe which is programmed to generate a trigger signal signaling contact of the measuring tip with a workpiece surface. 
     
     
       6. The machining device according to  claim 2 , wherein the probe is configured as a contactless sensor probe, such as an optical sensor and/or induction sensor and is configured for contact-free measurement of the workpiece. 
     
     
       7. The machining device according to  claim 1 , wherein the measuring system comprises a third linear axis which extends perpendicular to the first linear axis and perpendicular to the second linear axis. 
     
     
       8. The machining device according to  claim 7 , wherein the third linear axis is a third measurement axis. 
     
     
       9. The machining device according to  claim 2 , wherein said probe has one said measuring tip. 
     
     
       10. The machining device according to  claim 1 , wherein the measuring system comprises a camera unit arranged fixedly in the center of the first rotary machine axis and comprising a camera, focusable optics and/or lighting means. 
     
     
       11. The machining device according to  claim 10 , wherein a further camera is provided in the machining device to generate images of the workpiece. 
     
     
       12. The machining device according to  claim 11 , wherein measurement data from the measuring system is combined with measurement data from the further camera. 
     
     
       13. The machining device according to  claim 1 , wherein the measuring system is configured as a separate unit which is arrangeable in the center of the first rotary machine axis.