Liquid ejection head and liquid ejection apparatus

Abstract

A liquid ejection head and liquid ejection apparatus are capable of reducing or preventing a decrease in image quality without increasing the chip size. To achieve this, a configuration is employed in which a bonding layer is not provided between a liquid supply substrate and channel partitions between common supply channels and common collection channels, and a minute communication portion is provided there.

What is claimed is: 
     
       1. A liquid ejection head comprising:
 a plurality of ejection ports from which to eject a liquid; 
 a plurality of pressure chambers communicating with the ejection ports; 
 a plurality of pressure generating elements provided in the pressure chambers and being capable of ejecting the liquid from the corresponding ejection port by applying pressure; 
 individual supply channels communicating with the pressure chambers and being capable of supplying the liquid to the pressure chambers; 
 individual collection channels communicating with the pressure chambers and being capable of collecting the liquid from the pressure chambers; 
 a common supply channel communicating with the individual supply channels; 
 a common collection channel communicating with the individual collection channels; 
 a channel partition provided between the common supply channel and the common collection channel; 
 a first substrate where the channel partition is formed; 
 a second substrate laminated on the first substrate; 
 a communication portion communicating with the common supply channel and the common collection channel; and 
 a bonding layer provided between the first substrate and the second substrate, wherein 
 the communication portion communicating with the common supply channel and the common collection channel is provided at an area which is present between the first substrate where the channel partition is formed and the second substrate laminated on the first substrate, and corresponds to the channel partition, 
 the bonding layer includes a bonding area provided with an adhesive material and a non-bonding area provided with no adhesive material, and 
 the channel partition is provided at a position corresponding to the non-bonding area of the bonding layer. 
 
     
     
       2. The liquid ejection head according to  claim 1 , wherein circulatory flows flow through the common supply channel, the individual supply channels, the pressure chambers, the individual collection channels, and the common collection channel in the listed order. 
     
     
       3. The liquid ejection head according to  claim 1 , wherein viscous resistance of the communication portion is at least 100 times the viscous resistance of channels from the individual supply channels through the pressure chambers to the individual collection channels. 
     
     
       4. The liquid ejection head according to  claim 1 , wherein viscous resistance of the communication portion is at least 1000 times the viscous resistance of channels from the individual supply channels through the pressure chambers to the individual collection channels. 
     
     
       5. The liquid ejection head according to  claim 1 , wherein a height of the communication portion is 7 μm or less. 
     
     
       6. The liquid ejection head according to  claim 1 , wherein a height of the communication portion is 3 μm or less. 
     
     
       7. The liquid ejection head according to  claim 1 , wherein each of the pressure generating elements comprises a piezoelectric element. 
     
     
       8. The liquid ejection head according to  claim 1 , further comprising a damper member at least at one of the common supply channel or the common collection channel, the damper member being capable of absorbing pressure fluctuations occurring in the pressure chambers. 
     
     
       9. The liquid ejection head according to  claim 1 , further comprising a damper member at the common collection channel, the damper member being capable of absorbing pressure fluctuations occurring in the pressure chambers. 
     
     
       10. The liquid ejection head according to  claim 8 , wherein
 the plurality of ejection ports are provided so as to form an array, and 
 the damper member is provided so as to extend along the array of the ejection ports. 
 
     
     
       11. The liquid ejection head according to  claim 1 , wherein the individual supply channels, the individual collection channels, the common supply channel, and the common collection channel are formed in the first substrate. 
     
     
       12. A liquid ejection apparatus comprising:
 a liquid ejection head; and 
 a member that mounts the liquid ejection head, 
 wherein the liquid ejection head comprises:
 a plurality of ejection ports from which to eject a liquid; 
 a plurality of pressure chambers communicating with the ejection ports; 
 a plurality of pressure generating elements provided in the pressure chambers and being capable of ejecting the liquid from the corresponding ejection port by applying pressure; 
 individual supply channels communicating with the pressure chambers and being capable of supplying the liquid to the pressure chambers; 
 individual collection channels communicating with the pressure chambers and being capable of collecting the liquid from the pressure chambers; 
 a common supply channel communicating with the individual supply channels; 
 a common collection channel communicating with the individual collection channels; 
 a channel partition provided between the common supply channel and the common collection channel; 
 a first substrate where the channel partition is formed; 
 a second substrate laminated on the first substrate; 
 a communication portion communicating with the common supply channel and the common collection channel; and 
 a bonding layer provided between the first substrate and the second substrate, wherein 
 
 the communication portion communicating with the common supply channel and the common collection channel is provided at an area which is present between the first substrate where the channel partition is formed and the second substrate laminated on the first substrate, and corresponds to the channel partition, 
 the bonding layer includes a bonding area provided with an adhesive material and a non-bonding area provided with no adhesive material, and 
 the channel partition is provided at a position corresponding to the non-bonding area of the bonding layer.