Cell module

Abstract

A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.

What is claimed is: 
     
       1. A cell module, comprising:
 a first substrate; 
 a second substrate disposed opposite to the first substrate; 
 a cell unit disposed between the first substrate and the second substrate; 
 a first thermosetting resin layer disposed between the cell unit and the first substrate; 
 a first protective layer disposed between the cell unit and the first thermosetting resin layer, wherein the first protective layer comprises a first polymer, and a cross-linking degree of the first polymer is 22.2% to 42.3%; and 
 a second thermosetting resin layer disposed between the cell unit and the second substrate. 
 
     
     
       2. The cell module as claimed in  claim 1 , wherein the first protective layer has a thickness of 100 μm to 500 μm. 
     
     
       3. The cell module as claimed in  claim 1 , wherein the first polymer is a reaction product of a first composition, wherein the first composition comprises a first compound and a first cross-linking agent. 
     
     
       4. The cell module as claimed in  claim 3 , wherein the first compound is polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate rubber, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, propylene-ethyl methacrylate copolymer, propylene-ethyl acrylate copolymer, epoxy resin, polyurethane resin, diblock resin, triblock resin or a combination thereof. 
     
     
       5. The cell module as claimed in  claim 3 , wherein the first cross-linking agent is acrylate compound, methacrylate compound, allyl compound, vinyl compound, triallyl cyanurate, triallyl isocyanurate, triallylphosphate, triallyl borate, trimethallyl isocyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, diallylterephthalate, diallyl carbonate, diallyl maleate, diallyl fumarate, diallyl phosphite, trimethylolpropane diallyl ether, 1, 1,2,2-tetraallyloxyethane, or a combination thereof. 
     
     
       6. The cell module as claimed in  claim 1 , further comprising:
 a second protective layer disposed between the cell unit and the second thermosetting resin layer. 
 
     
     
       7. The cell module as claimed in  claim 6 , wherein the second protective layer has a thickness of 100 μm to 500 μm. 
     
     
       8. The cell module as claimed in  claim 6 , wherein the second protective layer comprises a second polymer, and a cross-linking degree of the second polymer is 22.2% to 42.3%.