Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape, and battery pack

Abstract

The present invention provides a curable pressure-sensitive adhesive composition, including a reactive polyacrylate, a liquid epoxy resin, a solid epoxy resin, a hydroxyl-containing compound, and a photoinitiator of specific contents. The curable pressure-sensitive adhesive composition may further include an epoxy silane coupling agent of a specific content. In addition, the present invention further provides a curable pressure-sensitive adhesive tape and a battery pack including the curable pressure-sensitive adhesive composition. The curable pressure-sensitive adhesive composition and the curable pressure-sensitive adhesive tape provided by the present invention have at least good bonding strength and good anti-warping performance, and can improve the stability and safety of battery packs.

What is claimed is: 
     
       1. A curable pressure-sensitive adhesive composition, comprising:
 30-65 parts of a reactive polyacrylate by weight, wherein the reactive polyacrylate has epoxy groups, carboxyl groups, or hydroxyl groups, and based on the total weight of 100% polyacrylate, the proportion of monomers with epoxy groups, hydroxyl groups, or carboxyl groups is 1.5-30% by weight; 
 30-40 parts of a liquid epoxy resin by weight; 
 10-20 parts of a solid epoxy resin by weight; 
 0.3-5 parts of a hydroxyl-containing compound by weight; and 
 0.02-3 parts of a photoinitiator by weight, wherein the epoxy equivalent of the liquid epoxy resin is 176-330 g/eq, and the epoxy equivalent of the solid epoxy resin is 450-800 g/eq. 
 
     
     
       2. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the reactive polyacrylate is a polyacrylate with an epoxy group, a carboxyl group, or a hydroxyl group. 
     
     
       3. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the content of the reactive polyacrylate is 30-50 parts by weight. 
     
     
       4. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the liquid epoxy resin is present in an amount of 30-40 parts by weight. 
     
     
       5. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the solid epoxy resin is present in an amount of 10-20 parts by weight. 
     
     
       6. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the hydroxyl-containing compound is a polyol. 
     
     
       7. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the hydroxyl-containing compound is present in an amount of 1-3 parts by weight. 
     
     
       8. The curable pressure-sensitive adhesive composition according to  claim 1 , wherein the photoinitiator is present in an amount of 1-2 parts by weight. 
     
     
       9. The curable pressure-sensitive adhesive composition according to  claim 1 , further comprising an epoxy silane coupling agent present in an amount of 0.05-1 parts by weight. 
     
     
       10. The curable pressure-sensitive adhesive composition according to  claim 1 , comprising:
 30-50 parts of the reactive polyacrylate by weight; 
 30-40 parts of the liquid epoxy resin by weight; 
 10-20 parts of the solid epoxy resin by weight; 
 1-3 parts of the hydroxyl-containing compound by weight; 
 1-2 parts of the photoinitiator by weight; and 
 0.05-1 part of an epoxy silane coupling agent by weight.