Power module

Abstract

The present invention relates to a power module that is capable of decreasing the number of components and assembling man-hours by applying a metal clip and performing an integrated soldering process and is capable of keeping a thickness of a soldering part constant and preventing movement of chips at the time of soldering by using a soldering jig.

What is claimed is: 
     
       1. A power module comprising:
 a circuit board; 
 chips disposed on the circuit board; and 
 a metal clip disposed on the chips and connected to the chips, 
 wherein chip solders are disposed between the circuit board and the chips, such that the circuit board and the chips are connected to each other by the chip solders, 
 clip solders are disposed between the chips and the metal clip, such that the chips and the metal clip are connected to each other by the clip solders, and 
 at least one of end portions of the metal clip is directly coupled to a lead frame. 
 
     
     
       2. The power module of  claim 1 , wherein each of the chip solders and the clip solders is a preformed solder. 
     
     
       3. The power module of  claim 1 , wherein the chip solders and the clip solders have a same melting point. 
     
     
       4. The power module of  claim 3 , wherein the chip solders and the clip solders are fused simultaneously in one process, such that the circuit board and the chips, and the chips and the metal clip are simultaneously soldered to each other. 
     
     
       5. The power module of  claim 1 , wherein the metal clip includes extension parts in contact with an upper surface of the circuit board. 
     
     
       6. The power module of  claim 1 , wherein one or more through holes penetrates through the metal clip. 
     
     
       7. The power module of  claim 1 , further comprising a molding part for molding the circuit board, the chips, and the metal clip,
 wherein an upper portion of the circuit board is occluded by the molding part. 
 
     
     
       8. The power module of  claim 1 , wherein the metal clip is configured to dissipate heat of the chips.