Submount architecture for multimode nodes

Abstract

Presented herein are a submount architecture for an electro-optical engine, which may be embodied as an apparatus in the form of at least an electro-optical engine and a multimode node, and a method for providing the same. According to at least one example, an apparatus includes a printed circuit board (PCB), a substrate with a finer structuring than the PCB, and electro-optical components. A bottom surface of the substrate is coupled to the PCB and electro-optical components are mounted on a top surface of the substrate. The electro-optical components include one or more optical components arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate.

What is claimed is: 
     
         1 . An apparatus comprising:
 a printed circuit board (PCB);   a substrate with a finer structuring than the PCB, wherein a bottom surface of the substrate is coupled to the PCB;   electro-optical components mounted on a top surface of the substrate, the electro-optical components including one or more optical components and one or more electrical components, wherein the one or more optical components are arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate;   an optical transfer assembly coupled to and extending from the substrate, wherein the optical transfer assembly includes one or more lenses to direct the optical signals toward and/or from the one or more optical components;   a first thermal pathway formed in the substrate, wherein the first thermal pathway directs heat dissipated by the one or more optical components in a first direction;   a second thermal pathway that directs heat dissipated by wherein the one or more electrical components in a second direction,   
       wherein the first direction is opposite from the second direction;
 a thermal void positioned in the substrate laterally between the one or more optical components and the one or more electrical components; and 
 a conductive pathway positioned in the substrate above the thermal void, wherein the conductive pathway operatively connects the one or more optical components to the one or more electrical components. 
 
     
     
         2 . The apparatus of  claim 1 , wherein the electro-optical components further comprise an integrated circuit that is coupled to the top surface of the substrate via flip-chip bonding. 
     
     
         3 . The apparatus of  claim 1 , wherein the one or more optical components include a laser that is coupled to the substrate via a wire bond so that the apparatus does not include chip-to-chip bond wires. 
     
     
         4 . The apparatus of  claim 1 , wherein the thermal void defines a thermal boundary between the first thermal pathway and the second thermal pathway. 
     
     
         5 . The apparatus of  claim 1 , wherein the first thermal pathway exits the substrate at the bottom surface of the substrate and the second thermal pathway extends in a direction away from the top surface of the substrate. 
     
     
         6 . The apparatus of  claim 5 , further comprising a heat sink disposed above the substrate, the heat sink forming at least a portion of the second thermal pathway. 
     
     
         7 . The apparatus of  claim 1 , wherein the substrate is coupled to the PCB via a ball grid array (BGA), wherein the first thermal pathway directs the heat dissipating from the one or more optical components downward through the substrate to the BGA, and wherein the BGA spreads the heat dissipating from the one or more optical components. 
     
     
         8 . The apparatus of  claim 1 , wherein the conductive pathway is a conductive trace. 
     
     
         9 . The apparatus of  claim 1 , wherein a bottom surface of the one or more optical components is secured to the top surface of the substrate via an adhesive material that conducts heat without deteriorating. 
     
     
         10 . The apparatus of  claim 1 , wherein the thermal void divides the substrate into a first section and a second section, wherein the first section is associated with the one or more optical components and the second section is associated with the one or more electrical components. 
     
     
         11 . An apparatus comprising:
 a printed circuit board (PCB);   a substrate, wherein a bottom surface of the substrate is coupled to the PCB;   electro-optical components mounted on the substrate, the electro-optical components including one or more optical components and one or more electrical components, wherein the one or more optical components are arranged to emit optical signals towards and/or receive optical signals from an area above the substrate;   an optical transfer assembly extending upward from the substrate, wherein the optical transfer assembly includes one or more lenses to direct the optical signals towards and/or from the one or more optical components;   a first heat dissipation path formed in the substrate to direct heat dissipated by the one or more optical components;   a second heat dissipation path to direct heat dissipated by the one or more electrical components, wherein the first heat dissipation path and the second heat dissipation path extend in opposite directions;   a thermal void positioned in the substrate laterally between the one or more optical components and the one or more electrical components; and   a conductive pathway positioned in the substrate above the thermal void, wherein the conductive pathway operatively connects the one or more optical components and the one or more electrical components.   
     
     
         12 . The apparatus of  claim 11 , wherein the electro-optical components further comprise an integrated circuit that is coupled to the substrate via flip-chip bonding. 
     
     
         13 . The apparatus of  claim 11 , wherein the one or more optical components include a laser that is coupled to the substrate via a wire bond so that the apparatus does not include chip-to-chip bond wires. 
     
     
         14 . The apparatus of  claim 11 , wherein the thermal void defines a thermal boundary between the first heat dissipation path and the second heat dissipation path. 
     
     
         15 . The apparatus of  claim 11 , wherein the first heat dissipation path exits the substrate at the bottom surface of the substrate and the second heat dissipation path extends in a direction away from a top surface of the substrate. 
     
     
         16 . The apparatus of  claim 11 , further comprising a heat sink disposed above the substrate, the heat sink forming at least a portion of the second heat dissipation path. 
     
     
         17 . The apparatus of  claim 11 , wherein the substrate is coupled to the PCB via a ball grid array (BGA), wherein the first heat dissipation path directs the heat dissipating from the one or more optical components downward through the substrate to the BGA, and wherein the BGA spreads the heat dissipating from the one or more optical components. 
     
     
         18 . The apparatus of  claim 11 , wherein the conductive pathway is a conductive trace. 
     
     
         19 . The apparatus of  claim 11 , wherein a bottom surface of the one or more optical components is secured to a top surface of the substrate via an adhesive material that conducts heat without deteriorating. 
     
     
         20 . The apparatus of  claim 11 , wherein the thermal void divides the substrate into a first section and a second section, wherein the first section is associated with the one or more optical components and the second section is associated with the one or more electrical components.