Heat dissipation device for display, and manufacturing method therefor

Abstract

Disclosed are a heat dissipation device for a display and a manufacturing method therefor. The heat dissipation device for a display enables the heat generated in a central processing unit provided in a flat panel display device to be quickly discharged to the outside and enables the thickness of the heat dissipation device to be minimized, and thus the overall thickness of the display device can be slim.

The invention claimed is: 
     
         1 . A heat dissipation device for a display, the heat dissipation device comprising a flat panel heatsink unit comprising a central processing unit (CPU) contacting part, a push pin coupling part, and an EMI gasket contacting part, and a heat dissipation plate connected to and installed at the heatsink unit,
 wherein the EMI gasket contacting part has a first inserting groove into which an upper end of an EMI gasket is inserted.   
     
     
         2 . A heat dissipation device for a display, the heat dissipation device comprising a flat panel heatsink unit comprising a central processing unit (CPU) contacting part, a push pin coupling part, and an EMI gasket contacting part, and a heat dissipation plate connected to and installed at the heatsink unit,
 wherein the EMI gasket contacting part has a first through hole, and is configured to support an inside surface of the first through hole to be in contact therewith.   
     
     
         3 . A heat dissipation device for a display, the heat dissipation device comprising a flat panel heatsink unit comprising a central processing unit (CPU) contacting part, a push pin coupling part, and an EMI gasket contacting part, and a heat dissipation plate connected to and installed at the heatsink unit,
 wherein the CPU contacting part protrudes upwards or depresses downwards by a bent part to cause a height difference from the heatsink unit around the CPU contacting part,   a first through hole into which an upper end of the EMI gasket is inserted is formed at the EMI gasket contacting part formed in the heatsink unit located at a relatively high position, and   a first inserting groove into which the upper end of the EMI gasket is inserted is formed at the EMI gasket contacting part formed in the heatsink unit located at a relatively low position.   
     
     
         4 . The heat dissipation device of  claim 1 , wherein the push pin coupling part has a second inserting groove into which a pressing part of a push pin is inserted, and a center portion of the second inserting groove has a third through hole through which a head part of the push pin passes. 
     
     
         5 . The heat dissipation device of  claim 2 , wherein the push pin coupling part has a second inserting groove into which a pressing part of a push pin is inserted, and a center portion of the second inserting groove has a third through hole through which a head part of the push pin passes. 
     
     
         6 . The heat dissipation device of  claim 3 , wherein the push pin coupling part has a second inserting groove into which a pressing part of a push pin is inserted, and a center portion of the second inserting groove has a third through hole through which a head part of the push pin passes.