US12479194B2ActiveUtilityA1

Laminate

66
Assignee: TOYO BOSEKIPriority: Jun 22, 2021Filed: Jun 9, 2022Granted: Nov 25, 2025
Est. expiryJun 22, 2041(~15 yrs left)· nominal 20-yr term from priority
B32B 2307/748B32B 2307/306B32B 2255/26B32B 2255/10B32B 27/36B32B 27/281B32B 27/16B32B 17/10B32B 7/06B32B 3/30B32B 2457/20B32B 2377/00B32B 2379/08B32B 7/023B32B 7/12B32B 9/045B32B 27/32B32B 2457/00B32B 27/08B32B 2307/412B32B 2307/71B32B 27/34
66
PatentIndex Score
0
Cited by
23
References
7
Claims

Abstract

The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
         1 . A laminate comprising an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film peeling auxiliary tape in this order,
 wherein   adhesive strength F1 between the inorganic substrate and the heat-resistant polymer film by a 90-degree peeling method,   adhesive strength F2 between the heat-resistant polymer film and the protective film by a 90-degree peeling method, and   adhesive strength F3 between the protective film and the protective film peeling auxiliary tape by a 90-degree peeling method   satisfy relation of F3>F1>F2 (1).   
     
     
         2 . The laminate according to  claim 1 , wherein an ultraviolet 50% cutoff wavelength of the protective film is 240 nm or more. 
     
     
         3 . The laminate according to  claim 1 , wherein a change rate of F2 after heating of the laminate at 120° C. for 10 minutes is 50% or less. 
     
     
         4 . The laminate according to  claim 1 , wherein an area B1 of the protective film and an area B2 of the protective film peeling auxiliary tape satisfy relation of B1>B2. 
     
     
         5 . The laminate according to  claim 1 , wherein an arithmetic mean waviness Wa of a surface of the protective film in contact with the heat-resistant polymer film is 30 nm or less. 
     
     
         6 . The laminate according to  claim 1 , wherein the heat-resistant polymer film includes at least one selected from the group consisting of polyimide, polyamide, and polyamide-imide. 
     
     
         7 . The laminate according to  claim 1 , wherein the heat-resistant polymer film is transparent polyimide.

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