Display device

Abstract

Provided is a display device. A display panel includes a plurality of subpixels and is supplied with an electrical signal through pixel pads to drive the subpixels. At least one driving circuit is mounted on a chip-on-film. The chip-on-film delivers the electrical signal through film pads electrically connected to the pixel pads. The chip-on-film includes an insulating film provided on side surfaces of the film pads.

The invention claimed is: 
     
         1 . A display device comprising:
 a display panel including a plurality of subpixels and supplied with an electrical signal through pixel pads to drive the subpixels; and   a chip-on-film on which at least one driving circuit is mounted, the chip-on-film configured to transmit the electrical signal through film pads electrically connected to the pixel pads,   wherein the chip-on-film includes an insulating film provided on side surfaces of the film pads.   
     
     
         2 . The display device of  claim 1 , wherein the driving circuit is a source driving integrated circuit supplying a data voltage to the display panel. 
     
     
         3 . The display device of  claim 1 , wherein the chip-on-film comprises:
 a film circuit board;   the film pads provided on the film circuit board at selected distances;   the insulating film disposed on side surfaces of the film pads; and   a thin film pattern covering the film pads and the insulating film.   
     
     
         4 . The display device of  claim 3 , wherein the thin film pattern includes tin (Sn). 
     
     
         5 . The display device of  claim 3 , wherein the thin film pattern includes a plurality of layers. 
     
     
         6 . The display device of  claim 3 , wherein a width of the thin film pattern is equal to a width of the insulating film. 
     
     
         7 . The display device of  claim 1 , wherein the film pads include at least one metal among copper (Cu), aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof. 
     
     
         8 . The display device of  claim 1 , wherein the insulating film includes at least one among silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and titanium oxide. 
     
     
         9 . The display device of  claim 1 , wherein a width of the insulating film ranges from 2% to 5% of a width of the film pads. 
     
     
         10 . A display device comprising:
 a display panel including a plurality of subpixels; and   a chip-on-film on which at least one driving circuit is mounted, the chip-on-film configured to transmit electrical signals through film pads electrically connected to pixel pads,   wherein the chip-on-film includes:
 a film circuit board; 
 the film pads provided on the film circuit board at selected distances; 
 a thin film pattern covering the film pads; and 
 an insulating film provided on side surfaces of the film pads. 
   
     
     
         11 . The display device of  claim 10 , wherein the film pads comprise at least one metal among copper (Cu), aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof. 
     
     
         12 . The display device of  claim 10 , wherein the insulating film includes at least one among silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and titanium oxide. 
     
     
         13 . A device comprising:
 a film circuit board;   a film pad on the film circuit board, the film pad including a first surface opposite a second surface, a third surface opposite a fourth surface, the fourth surface facing the film circuit board, the film pad having a first width defined between the first surface and the second surface; and   an insulating film disposed adjacent to the first surface and the second surface of the film pad, the insulating film having a second width.   
     
     
         14 . The device of  claim 13 , further comprising a thin film pattern on the first surface, the second surface, and the third surface of the film pad, the thin film pattern having a third width at either the first surface or the second surface of the film pad. 
     
     
         15 . The device of  claim 14 , wherein the insulating film is in contact with the first surface and the second surface of the film pad, and
 wherein the thin film pattern contacts the third surface of the film pad.   
     
     
         16 . The device of  claim 15 , wherein the third width of the thin film pattern is equal to the second width of the insulating film. 
     
     
         17 . The device of  claim 14 , wherein the thin film pattern includes tin (Sn). 
     
     
         18 . The device of  claim 14 , wherein the thin film pattern includes a plurality of layers. 
     
     
         19 . The device of  claim 13 , wherein the insulating film is spaced apart from the first surface and the second surface of the film pad, and
 wherein the thin film pattern contacts the first surface, the second surface, and the third surface of the film pad.   
     
     
         20 . The device of  claim 19 , wherein the insulating film does not overlap with the thin film pattern from a plan view. 
     
     
         21 . The device of  claim 19 , wherein an upper surface of the insulating film and an upper surface of the thin film pattern are flush with each other. 
     
     
         22 . The device of  claim 19 , wherein the third width of the thin film pattern is equal to the second width of the insulating film. 
     
     
         23 . The device of  claim 13 , wherein the second width of the insulating film is about 2% to 5% of the first width of the film pad.