US12491585B2ActiveUtilityA1

Low silver solder for welding the electric vacuum device and a preparation method thereof

65
Assignee: HANGZHOU HUAGUANG ADVANCED WELDING MAT CO LTDPriority: Dec 4, 2020Filed: Aug 18, 2022Granted: Dec 9, 2025
Est. expiryDec 4, 2040(~14.4 yrs left)· nominal 20-yr term from priority
C22C 5/08C22C 1/02B23K 35/40B23K 2101/36C22C 1/03B23K 35/3006
65
PatentIndex Score
0
Cited by
16
References
3
Claims

Abstract

A silver solder for welding an electric vacuum device consisting of the following components in percentage by mass: 65-71% of Ag, 0-0.1% of Ni, 0-0.1% of trace element R and balance of Cu; the trace element R consists of one or more of P, Sc, Be, Zr and La. A method of producing the silver solder, comprising the steps of: evenly presetting Ag, Cu except from copper foil and Ni in a smelting crucible, placing the trace element R wrapped by the copper foil above the Ag, Cu except from copper foil and Ni, then smelting and casting the Ag, Cu but except from copper foil, Ni and the trace element R by adopting a vacuum induction smelting furnace, the vacuum degree of the furnace reaches 10 −1 Pa during smelting and casting, and finally a strip material or a wire material is prepared by a post treatment process.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A low silver solder for welding an electric vacuum device, consisting of Ag, Cu, Ni and a trace element R, wherein the low silver solder consists of the following components in percentage by mass: 65-71% of Ag, 0.02-0.1 of Ni, 0.0001-0.1% of trace element R and the balance of Cu; the trace element R is selected from Sc, Be, Zr and/or La. 
     
     
         2 . The low silver solder according to  claim 1 , wherein a mass percent of the trace element R in the low silver solder is 0.0005-0.01 percent. 
     
     
         3 . The low silver solder according to  claim 1 , wherein a mass percent of the element Ni in the low silver solder is 0.05-0.08 percent.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.