US12503383B2ActiveUtilityA1

Semiconductor chemical mechanical polishing sludge recycling device

48
Assignee: HSIEH YA MINPriority: Mar 23, 2023Filed: Mar 23, 2023Granted: Dec 23, 2025
Est. expiryMar 23, 2043(~16.7 yrs left)· nominal 20-yr term from priority
C02F 2101/30C02F 11/127C02F 11/143C02F 2103/346C02F 11/18C01B 33/12C02F 11/13C02F 9/00
48
PatentIndex Score
0
Cited by
25
References
1
Claims

Abstract

The present invention relates to a semiconductor chemical mechanical polishing sludge recycling device, which includes a roasting device, a soaking and stirring device, a first centrifugal dehydration device, a cleaning device and a second centrifugal dehydration device arranged thereon. The roasting device heat-treats the semiconductor chemical mechanical polishing sludge to remove the impurities. The soaking and stirring device is connected with the roasting device. The roasted semiconductor chemical mechanical polishing sludge is placed in the soaking and stirring device. The first centrifugal dehydration device is connected with the soaking and stirring device. A product obtained by the soaking and stirring device is solidified and concentrated through the first centrifugal dehydration device. The cleaning device is connected with the first centrifugal dehydration device. The second centrifugal dehydration device is connected with the cleaning device. The product obtained through the centrifugation of the second centrifugal dehydration device is a silicon dioxide goods.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A semiconductor chemical mechanical polishing sludge recycling device, comprising a roasting device, a soaking and stirring device, a first centrifugal dehydration device, a cleaning device and a second centrifugal dehydration device arranged thereon, wherein the roasting device is used for heat treatment of a semiconductor chemical mechanical polishing sludge to remove an organic impurity and form a roasted semiconductor chemical mechanical polishing sludge, wherein the soaking and stirring device is connected with the roasting device for placing the roasted semiconductor chemical mechanical polishing sludge in the soaking and stirring device for immersion and stirring to obtain a product, wherein the soaking and stirring device includes an adding device arranged thereon, wherein the adding device has an impregnating liquid contained therein, wherein the first centrifugal dehydration device is connected with the soaking and stirring device for removing the impregnating liquid in the product to obtain a solidified and concentrated product, wherein the cleaning device is connected with the first centrifugal dehydration device for washing the solidified and concentrated product, wherein the second centrifugal dehydration device is connected with the cleaning device to centrifugally dehydrate the washing solidified and concentrated product to obtain a silicon dioxide.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.