Apparatus, a system and a method for transmitting electromagnetic waves

Abstract

An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves. The apparatus includes a coupling element. The coupling element includes a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure. The apparatus further includes a vacuum channel structure including an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.

What is claimed is: 
     
         1 . An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves, the apparatus comprising:
 a coupling element comprising a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure; and   a vacuum channel structure comprising an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.   
     
     
         2 . The apparatus according to  claim 1 , wherein the apparatus comprises first means for aligning the coupling element with the printed circuit board. 
     
     
         3 . The apparatus according to  claim 2 , wherein the first means for aligning the coupling element with the printed circuit board comprises a plurality of pins for aligning the coupling element with the printed circuit board. 
     
     
         4 . The apparatus according to  claim 1 , wherein the apparatus comprises an opening coupled with the inlet for sucking air from the opening to the inlet. 
     
     
         5 . The apparatus according to  claim 1 , wherein the coupling element comprises a structure for receiving a vacuum sealing element on the first surface of the coupling element for generating a seal between the first surface of the coupling element and the second surface of the printed circuit board. 
     
     
         6 . The apparatus according to  claim 1 , wherein the coupling element comprises a flat structure for coupling with a flat surface of the printed circuit board to generate a seal between the first surface of the coupling element and the second surface of the printed circuit board. 
     
     
         7 . The apparatus according to  claim 1 , wherein the coupling element comprises a recess, wherein a boundary section of the recess forms the first surface of the coupling element. 
     
     
         8 . The apparatus according to  claim 7 , wherein the inlet is coupled to the recess to suck air from the recess to the inlet. 
     
     
         9 . The apparatus according to  claim 1 , wherein the first wave transmission structure extends to a third surface of the coupling element, wherein the third surface comprises means for detachably coupling a wave transmission element to the coupling element to transmit the electromagnetic waves to a second wave transmission structure of the wave transmission element. 
     
     
         10 . The apparatus according to  claim 9 , wherein the coupling element comprises at least one of:
 mounting means for detachably mounting the wave transmission element to the coupling element; or   means for aligning the wave transmission element with the coupling element.   
     
     
         11 . The apparatus according to any of  claim 1 , wherein the coupling element comprises a plurality of first wave transmission structures. 
     
     
         12 . A system comprising:
 a printed circuit board; and   an apparatus comprising:
 a coupling element comprising a first wave transmission structure configured to receive electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure; and 
 a vacuum channel structure comprising an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied. 
   
     
     
         13 . The system according to  claim 12 , wherein the apparatus comprises first means for aligning the coupling element with the printed circuit board, and wherein the printed circuit board comprises means for cooperative mechanical coupling with the first means to align the coupling element with the printed circuit board. 
     
     
         14 . The system according to  claim 12 , wherein the printed circuit board comprises;
 a board wave transmission structure for transmitting the electromagnetic waves from a semiconductor chip to a wave coupling structure on the printed circuit board, wherein the wave coupling structure is configured to couple the electromagnetic waves from the printed circuit board to the first wave transmission structure.   
     
     
         15 . The system according to  claim 12 , wherein the first wave transmission structure is coupled to a radio frequency (RF) testing device configured to receive the electromagnetic waves from the first wave transmission structure and to analyze at least one property of the electromagnetic waves. 
     
     
         16 . A method for transferring electromagnetic waves from a board wave transmission structure arranged on a printed circuit board to a first wave transmission structure of a coupling element, the method comprising:
 generating a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force is applied between the coupling element and the printed circuit board; and   transmitting the electromagnetic waves from the board wave transmission structure to the first wave transmission structure.   
     
     
         17 . The method according to  claim 16 , wherein generating the vacuum comprises:
 sucking air from an opening formed in the coupling element to an inlet connected to a vacuum generator.   
     
     
         18 . The method according to  claim 17 , further comprising:
 after generating the vacuum, breaking the vacuum by allowing air to flow into the opening; and   detaching the coupling element from the printed circuit board.   
     
     
         19 . The method according to  claim 18 , further comprising: generating a further vacuum between the first surface of the coupling element and a further second surface of a further printed circuit board such that a force is applied between the coupling element and the further printed circuit board, wherein the further printed circuit board comprises a further board wave transmission structure; and
 transmitting further electromagnetic waves from the further board wave transmission structure to the first wave transmission structure.   
     
     
         20 . A method according to  claim 16 , further comprising:
 coupling a wave transmission element comprising a second wave transmission structure to the coupling element; and   transmitting the further electromagnetic waves from the first wave transmission structure via the second wave transmission structure to an RF testing device.