Semiconductor composite device and method for manufacturing semiconductor composite device

Abstract

A semiconductor composite device includes active elements and passive elements constituting a voltage regulator and disposed in association with a plurality of channels, a load to be supplied with a direct-current voltage regulated by the voltage regulator, and a wiring board electrically connected to the active elements, the passive elements, and the load. A plurality of capacitors disposed in the channels include an integrally formed capacitor array including a plurality of capacitor portions disposed in a plane. The capacitor array includes a plurality of through hole conductors extending through the capacitor array in a direction perpendicular to a mounting surface of the wiring board. At least a part of the capacitor array is positioned to overlap the load when viewed from the mounting surface of the wiring board.

The invention claimed is: 
     
         1 . A semiconductor composite device comprising:
 a voltage regulator including a plurality of active elements and a plurality of passive elements and arranged with a plurality of channels;   a load including a semiconductor element and configured to be supplied with a direct-current voltage and regulated by the voltage regulator; and   a wiring board electrically connected to the plurality of active elements, the plurality of passive elements, and the load,   wherein the active elements of the voltage regulator include switching elements,   wherein the passive elements of the voltage regulator include capacitors, and a plurality of the capacitors disposed in the plurality of channels comprise an integrally formed capacitor array comprising a plurality of capacitor portions disposed in a plane,   wherein the capacitor array comprises a plurality of through hole conductors extending through the capacitor array in a direction perpendicular to a mounting surface of the wiring board.   
     
     
         2 . The semiconductor composite device according to  claim 1 , wherein at least a portion of the capacitor array is positioned to overlap the load when viewed from the mounting surface of the wiring board. 
     
     
         3 . The semiconductor composite device according to  claim 1 , wherein the integrally formed capacitor array is connected to two or more channels out of the plurality of channels. 
     
     
         4 . The semiconductor composite device according to  claim 1 , wherein the passive elements including the voltage regulator further includes inductors connected between the switching elements and the load,
 wherein the inductors disposed in at least one of the channels are electrically connected to the through hole conductors extending through the capacitor array, and   wherein at least parts of the inductors electrically connected to the through hole conductors are positioned to overlap the capacitor array when viewed from the mounting surface of the wiring board.   
     
     
         5 . The semiconductor composite device according to  claim 4 , wherein the through hole conductors connected to the inductors are connected to a positive terminal of the capacitor. 
     
     
         6 . The semiconductor composite device according to  claim 4 ,
 wherein the channel in which the inductors are electrically connected to the through hole conductors constitutes a multi-phase power supply comprising a plurality of power supply circuits connected in parallel,   wherein the through hole conductors connected to the inductors disposed in the respective power supply circuits constituting the multi-phase power supply are connected to a positive terminal of the capacitor, and   wherein the plurality of through hole conductors connected to the respective inductors are electrically connected via the positive terminal of the capacitor.   
     
     
         7 . The semiconductor composite device according to  claim 4 , wherein the inductors electrically connected to the through hole conductors are disposed opposite the load when viewed from the capacitor array. 
     
     
         8 . The semiconductor composite device according to  claim 7 , wherein the inductors electrically connected to the through hole conductors are disposed on the mounting surface of the wiring board. 
     
     
         9 . The semiconductor composite device according to  claim 8 , wherein, in the channel in which the inductors are electrically connected to the through hole conductors, at least parts of the switching elements are positioned to overlap the capacitor array when viewed from the mounting surface of the wiring board. 
     
     
         10 . The semiconductor composite device according to  claim 1 , wherein at least one through hole conductor out of the through hole conductors extending through the capacitor array is connected to a positive terminal of the capacitor. 
     
     
         11 . The semiconductor composite device according to  claim 10 , wherein the capacitor comprises a positive terminal plate made of a metal, and
 wherein the through hole conductor connected to the positive terminal of the capacitor is connected to an end surface of the positive terminal plate.   
     
     
         12 . The semiconductor composite device according to  claim 10 , wherein the passive elements constituting the voltage regulator further comprise inductors connected between the switching elements and the load, and
 wherein the inductors disposed in at least one of the channels are electrically connected to the through hole conductor connected to the positive terminal of the capacitor.   
     
     
         13 . The semiconductor composite device according to  claim 1 , wherein at least one through hole conductor out of the through hole conductors extending through the capacitor array is connected to a negative terminal of the capacitor. 
     
     
         14 . The semiconductor composite device according to  claim 1 , wherein the capacitor array comprises the plurality of capacitor portions obtained by dividing a single capacitor sheet formed from an aluminum element. 
     
     
         15 . The semiconductor composite device according to  claim 1 , wherein the capacitor array is embedded in the wiring board.