Radio frequency module and communication device

Abstract

A radio frequency module includes a module substrate having a principal surface, one or more circuit components disposed on a principal surface side, a resin member disposed on the principal surface side and covering a side surface of the one or more circuit components, a metal shield layer in contact with a top surface of the resin member and a top surface of the one or more circuit components, and an engraved portion provided on the top surface of the one or more circuit components.

The invention claimed is: 
     
         1 . A radio frequency module comprising:
 a module substrate having a principal surface;   one or more circuit components disposed on the principal surface;   a resin member placed on the principal surface and covering a side surface of the one or more circuit components;   a metal layer in contact with a top surface of the resin member and top surfaces of the one or more circuit components; and   an engraved portion provided on the top surfaces of the one or more circuit components.   
     
     
         2 . The radio frequency module according to  claim 1 ,
 wherein the engraved portion is provided only on the top surfaces of the one or more circuit components.   
     
     
         3 . The radio frequency module according to  claim 1 ,
 wherein the engraved portion is provided on the top surfaces of the one or more circuit components and the top surface of the resin member.   
     
     
         4 . The radio frequency module according to  claim 1 ,
 wherein the one or more circuit components comprise a plurality of circuit components, and   the engraved portion is provided on top surfaces of all of the plurality of circuit components.   
     
     
         5 . The radio frequency module according to  claim 1 ,
 wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.   
     
     
         6 . The radio frequency module according to  claim 1 ,
 wherein the one or more circuit components include a filter having a pass band in a radio frequency band.   
     
     
         7 . The radio frequency module according to  claim 1 ,
 wherein the one or more circuit components include a power amplifier configured to amplify a transmitting signal.   
     
     
         8 . The radio frequency module according to  claim 1 ,
 wherein the resin member contains a filler.   
     
     
         9 . The radio frequency module according to  claim 1 ,
 wherein the top surfaces of the one or more circuit components are flush with the top surface of the resin member.   
     
     
         10 . The radio frequency module according to  claim 1 ,
 wherein the engraved portion includes a character, a figure, a symbol, or a two-dimensional code.   
     
     
         11 . A communication device comprising:
 an RF signal processing circuit configured to process radio frequency signals transmitted and received by an antenna; and   the radio frequency module according to  claim 1 , configured to transmit the radio frequency signals between the antenna and the RF signal processing circuit.   
     
     
         12 . The radio frequency module according to  claim 2 ,
 wherein the one or more circuit components comprise a plurality of circuit components, and   the engraved portion is provided on top surfaces of all of the plurality of circuit components.   
     
     
         13 . The radio frequency module according to  claim 3 ,
 wherein the one or more circuit components comprise a plurality of circuit components, and   the engraved portion is provided on top surfaces of all of the plurality of circuit components.   
     
     
         14 . The radio frequency module according to  claim 2 ,
 wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.   
     
     
         15 . The radio frequency module according to  claim 3 ,
 wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.   
     
     
         16 . The radio frequency module according to  claim 4 ,
 wherein the one or more circuit components are placed closer to an edge of the principal surface than to a center of the principal surface when the principal surface is viewed in plan.   
     
     
         17 . The radio frequency module according to  claim 2 ,
 wherein the one or more circuit components include a filter having a pass band in a radio frequency band.   
     
     
         18 . The radio frequency module according to  claim 3 ,
 wherein the one or more circuit components include a filter having a pass band in a radio frequency band.   
     
     
         19 . The radio frequency module according to  claim 4 ,
 wherein the one or more circuit components include a filter having a pass band in a radio frequency band.   
     
     
         20 . The radio frequency module according to  claim 5 ,
 wherein the one or more circuit components include a filter having a pass band in a radio frequency band.