Power apparatus with electromagnetic interference reduction function

Abstract

A power apparatus includes a substrate, a first power circuit, and a second power circuit. The substrate includes a first metallization region, a second metallization region, and a third metallization region which are separated from each other. The first power circuit is electrically connected to the first metallization region and the third metallization region, and is arranged across the second metallization region and fails to be in contact with the second metallization region. The second power circuit is electrically connected to the second metallization region and the third metallization region, and fails to be in contact with the first metallization region.

What is claimed is: 
     
         1 . A power apparatus comprising:
 a substrate comprising a first metallization region, a second metallization region, and a third metallization region which are arranged sequentially and inwards, wherein the second metallization region is arranged between the first metallization region and the third metallization region;   a plurality of first power circuits comprising a first switching component and a first conductive component which are electrically connected to each other, wherein the first switching component is arranged on the first metallization region, and the first conductive component is arranged across the second metallization region and fails to be in contact with the second metallization region, and one end of the first conductive component is in contact with the first switching component, and the other end of the first conductive component is in contact with the third metallization region, and the first switching component is electrically connected to the third metallization region through the first conductive component;   a plurality of second power circuits comprising a second switching component and a second conductive component which are electrically connected to each other, wherein the second switching component is arranged on the third metallization region, and the second conductive component fails to be in contact with the first metallization region, and one end of the second conductive component is in contact with the second switching component, and the other end of the second conductive component is in contact with the second metallization region, and the second switching component is electrically connected to the second metallization region through the second conductive component;   a first electrode pin arranged on the first metallization region, the first electrode pin comprising a plurality of first sub pins; and   a second electrode pin arranged on the second metallization region, the second electrode pin comprising a plurality of second sub pins,   wherein the first power circuits and the second power circuits are in pairs and are staggered on the substrate,   wherein the first conductive component and the second conductive component are parallel to each other, and   wherein the first sub pins and the second sub pins are staggered with each other, the first sub pins are arranged on the first metallization region, the second sub pins are arranged on the second metallization region, and the second metallization region is U-shaped.   
     
     
         2 . The power apparatus of  claim 1 , wherein the first conductive component is a copper clip, a conductive wire, a ceramic clip, or a chip embedding printed circuit board; the second conductive component is a copper clip, a conductive wire, a ceramic clip, or a chip embedding printed circuit board. 
     
     
         3 . The power apparatus of  claim 2 , wherein a plurality of first positions on the first metallization region where the first sub pins are arranged and a plurality of second positions on the second metallization region where the second sub pins are arranged are staggered with each other. 
     
     
         4 . A power apparatus comprising:
 a substrate comprising a first metallization region, a second metallization region, and a third metallization region which are separated from each other;   a plurality of first power circuits electrically connected to the first metallization region and the third metallization region, and being arranged across the second metallization region, and failing to be in contact with the second metallization region; and   a plurality of second power circuits electrically connected to the second metallization region and the third metallization region, and failing to be in contact with the first metallization region;   a first electrode pin arranged on the first metallization region, the first electrode pin comprising a plurality of first sub pins; and   a second electrode pin arranged on the second metallization region, the second electrode pin comprising a plurality of second sub pins,   wherein the first power circuits comprise a first switching component and a first conductive component which are electrically connected to each other; the first switching component is arranged on the first metallization region; the first conductive component is arranged across the second metallization region, and fails to be in contact with the second metallization region; one end of the first conductive component is in contact with the first switching component; the other end of the first conductive component is in contact with the third metallization region; the first switching component is electrically connected to the third metallization region through the first conductive component,   wherein the second power circuits comprise a second switching component and a second conductive component which are electrically connected to each other; the second switching component is arranged on the third metallization region; the second conductive component fails to be in contact with the first metallization region; one end of the second conductive component is in contact with the second switching component; the other end of the second conductive component is in contact with the second metallization region; the second switching component is electrically connected to the second metallization region through the second conductive component,   wherein the first power circuits and the second power circuits are in pairs and are staggered on the substrate; the first conductive component and the second conductive component are parallel to each other,   wherein the first sub pins and the second sub pins are staggered with each other, the first sub pins are arranged on the first metallization region, the second sub pins are arranged on the second metallization region, the second metallization region is U-shaped, the first conductive component is a copper clip, a conductive wire, a ceramic clip, or a chip embedding printed circuit board; the second conductive component is a copper clip, a conductive wire, a ceramic clip, or a chip embedding printed circuit board.   
     
     
         5 . The power apparatus of  claim 4 , wherein a plurality of first positions on the first metallization region where the first sub pins are arranged and a plurality of second positions on the second metallization region where the second sub pins are arranged are staggered with each other.