Integrated circuit device
Abstract
An integrated circuit device includes a heating element, and a temperature sensor configured to detect a temperature of the heating element. An outer shape of the integrated circuit device has a first side and a second side intersecting the first side, and when a direction along the first side of the integrated circuit device is set as an X direction and a direction along the second side is set as a Y direction, the heating element includes a first heating element, and a second heating element arranged adjacent to the first heating element along the Y direction with a region AR interposed therebetween. The temperature sensor is arranged at an arrangement position where a position in the X direction is a position between a center of the region AR and the second side, and a position in the Y direction is a position between the first heating element and the second heating element.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An integrated circuit device, comprising:
a charging transistor configured to charge a load; a discharging transistor configured to discharge the load; a control circuit configured to control a current flowing through the charging transistor and a current flowing through the discharging transistor; a first temperature sensor configured to detect a temperature of the charging transistor; and a second temperature sensor configured to detect a temperature of the discharging transistor, wherein an outer shape of the integrated circuit device has a first side and a second side intersecting the first side, when a direction along the first side of the integrated circuit device is set as an X direction and a direction along the second side is set as a Y direction, the charging transistor includes a first charging transistor, and a second charging transistor arranged adjacent to the first charging transistor along the Y direction with a first region interposed therebetween, the discharging transistor includes a first discharging transistor, and a second discharging transistor arranged adjacent to the first discharging transistor along the Y direction with a second region interposed therebetween, the first temperature sensor is arranged at a first arrangement position where a position in the X direction is a position between a center of the first region and the second side, and a position in the Y direction is a position between the first charging transistor and the second charging transistor, and the second temperature sensor is arranged at a second arrangement position where a position in the X direction is a position between a center of the second region and the second side, and a position in the Y direction is a position between the first discharging transistor and the second discharging transistor.
2 . The integrated circuit device according to claim 1 , wherein
an outer shape of the first region between the first charging transistor and the second charging transistor has a first region side close to the second side and a second region side farther from the second side than is the first region side, an outer shape of the second region between the first discharging transistor and the second discharging transistor has a third region side close to the second side and a fourth region side farther from the second side than is the third region side, the first temperature sensor is arranged between the center of the first region and the first region side, and the second temperature sensor is arranged between the center of the second region and the third region side.
3 . The integrated circuit device according to claim 1 , wherein
the outer shape of the integrated circuit device further has a third side which is an opposite side of the first side, the charging transistor is arranged between the first side and a center line of the first side and the third side, and the discharging transistor is arranged between the third side and the center line.
4 . The integrated circuit device according to claim 1 , wherein
a first pad for load coupling and a second pad for first power supply coupling are provided at a region of the charging transistor, and a third pad for load coupling and a fourth pad for second power supply coupling are provided at a region of the discharging transistor.Cited by (0)
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