Electronic apparatus, electronic apparatus manufacturing method, and mold device

Abstract

In an electronic apparatus such as a portable computer provided with an electronic apparatus frame having a boss portion, a protrusion is formed in a position for the boss portion, the electronic apparatus comprising a boss separator formed having a retaining hole and attached to the protrusion to form the boss portion.

What is claimed is:  
     
         1 . In a mold device comprising pin members provided projecting from an upper mold or a lower mold in order to form a frame having pores arranged at given pitches, 
 the lower mold or the upper mold opposed to the respective projecting end portions of the pin members having a depression such that said pin members can be formed projecting longer than the wall thickness of the frame and that an inflow bypass portion kept at a given space from the respective projecting end portions of said pin members can be provided in positions for the pin members.    
     
     
         2 . An electronic apparatus manufacturing method for molding a frame of an electronic apparatus having pores arranged at given pitches, by means of the mold device according to    claim 1   , comprising: 
 a flowing process for causing a molten metal to flow in said inflow bypass portion and diffuse throughout the interior of the mold device;    a solidifying process for solidifying the molten metal introduced into the mold device in said flowing process, thereby forming a molded piece; and    a working process for forming penetrating pores by machining a raised portion corresponding to said depression of the molded piece formed in said solidifying process and making the raised portion flush with the other portion.    
     
     
         3 . In an electronic apparatus comprising a frame formed having pores arranged at given pitches, 
 said pores being initially surrounded by a raised portion formed having pore shapes deeper than the wall thickness of said frame, the electronic apparatus having a machined surface around the penetrating pores formed by machining the raised portion so that the raised portion is flush with the other portion of the frame.    
     
     
         4 . In an electronic apparatus comprising a frame formed having pores arranged at given pitches, 
 said pores being initially surrounded by a raised portion formed having pore shapes deeper than the wall thickness of said frame, said penetrating pores being formed by removing the raised portion by machining.    
     
     
         5 . An electronic apparatus according to    claim 3   , wherein said frame is formed of a magnesium alloy as a material.