Mold device, electronic apparatus, and electronic apparatus manufacturing method

Abstract

In a mold device comprising pin members provided projecting from an upper mold or a lower mold in order to form an electronic apparatus frame of a metallic material having pores arranged at given pitches, the pin members are arranged so that a center line connecting the adjacent pin members is not perpendicular to the direction of introduction of a molten metal into a cavity of the mold device.

What is claimed is:  
     
         1 . In a mold device comprising pin members provided projecting from a first mold or a second mold in order to form an electronic apparatus frame of a metallic material having pores arranged at given pitches, 
 said pin members being arranged so that a center line connecting the closest adjacent pin members is not perpendicular to the direction of introduction of a molten metal into a cavity of the mold device.    
     
     
         2 . In a mold device comprising pin members provided projecting from a first mold or a second mold in order to form an electronic apparatus frame of a metallic material having pores arranged at given pitches, 
 said pin members being arranged so that one row of pin members, out of each two adjacent rows of pin members, is shifted substantially for half the pitch in the direction thereof with respect to the other row of pin members.    
     
     
         3 . In a mold device comprising pin members provided projecting from a first mold or a second mold in order to form an electronic apparatus frame of a metallic material having pores arranged at given pitches, 
 said pin members being arranged in a zigzag array.    
     
     
         4 . In a mold device comprising pin members provided projecting from a first mold or a second mold in order to form an electronic apparatus frame of a metallic material having pores arranged at given pitches, 
 said pin members being arranged in zigzag with respect to the direction of introduction of a molten metal.    
     
     
         5 . An electronic apparatus manufacturing method for molding an electronic apparatus including a frame of a metallic material having pores arranged at given pitches, by means of a mold device, comprising: 
 a flowing process for diffusing a molten metal throughout the interior of said mold device; and    a solidifying process for solidifying the molten metal introduced into the mold device in said flowing process, thereby forming the frame,    said mold device being the mold device according to any one of    claims 1    to    4   .    
     
     
         6 . In an electronic apparatus including an electronic apparatus frame of a metallic material having pores arranged at given pitches, 
 said electronic apparatus frame being formed by casting.    
     
     
         7 . An electronic apparatus according to    claim 6   , wherein said metallic material is magnesium.