Heat conductive mold and manufacturing method thereof
Abstract
A heat conductive mold is provided in which boron nitride powder has a magnetic field which is oriented in a fixed direction within a polymer. The polymer is preferably at least one selected from silicon rubber, epoxy, Polyimide and polyurethane. The content of the boron nitride powder is from twenty-two 400 weight parts to 100 weight parts ofpolymer. A method is also provided in which a heat conductive mold of excellent heat conductivity is provided. The method includes impressing a magnetic field to the polymer composition containing boron nitride powder. The magnetic field impressed on the boron nitride powder, in the composition is impressed to have a fixed direction. The field is set after the direction is established. As an alternative, the method may include pressing the magnetic field to the polymer composition including the boron nitride powder and also a solvent.
Claims
exact text as granted — not AI-modified1 . A heat conductive mold, wherein boron nitride powder is magnetic field oriented to a fixed direction in a polymer.
2 . The heat conductive mold of claim 1 , wherein the polymer is at least one selected from silicon rubber, epoxy, polyimide and polyurethane.
3 . The heat conductive mold of claim 1 or 2 , wherein the content of boron nitride powder is 20 to 400 weight parts to 100 weight parts of polymer.
4 . A manufacturing method of heat conductive mold of excellent heat conductivity, by impressing magnetic field to the polymer composition containing boron nitride powder, field orienting boron nitride powder in the composition to a fixed direction, and then setting the same.
5 . A manufacturing method of heat conductive mold of excellent heat conductivity, by impressing magnetic field to the polymer composition containing boron nitride powder and solvent, field orienting boron nitride powder in the composition to a fixed direction, and then setting the same after having removed the solvent.Join the waitlist — get patent alerts
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