Circuit-forming charging powder and multilayer wiring board using the same

Abstract

A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.

What is claimed is:  
     
         1 . A circuit-forming charging powder for use in printing a circuit pattern on an object by electrophotography, comprising a conductive metal powder, a heat-melt resin, a charge control agent and an adhesion reinforcing agent.  
     
     
         2 . The circuit-forming charging powder according to    claim 1   , wherein said conductive metal is at least one member selected from the group consisting of copper, gold, silver, nickel, palladium or molybdenum.  
     
     
         3 . The circuit-forming charging powder according to    claim 1   , wherein said charge control agent is at least one member selected from the group consisting of a metallic azo dye, a chlorinated paraffin, a chlorinated polyester, an acid-excess polyester, a sulfonylamine naphthenic acid metal salt of copper phthalocyanine, a metal salt of fatty acid and resinate soap.  
     
     
         4 . The circuit-forming charging powder according to    claim 1   , wherein said adhesion reinforcing agent is at least one member selected from the group consisting of silica glass, borosilicate glass, soda lime, lead glass, aluminosilicate glass, alumina and ferrite.  
     
     
         5 . The circuit-forming charging powder according to    claim 1   , wherein the particle size of said circuit-forming charging powder is in the range of about 3 to 20 μm.  
     
     
         6 . The circuit-forming charging powder according to    claim 1   , wherein the content of said conductive metal powder in the circuit-forming charging powder is more than about 90 wt % and less than or equal to about 98 wt %.  
     
     
         7 . The circuit-forming charging powder according to    claim 1   , wherein the content of said heat-melt resin in the circuit-forming charging powder is less than about 10 wt %.  
     
     
         8 . The circuit-forming charging powder according to    claim 7   , wherein the content of said conductive metal powder in the circuit-forming charging powder is more than about 90 wt % and less than or equal to about 98 wt %. and wherein the particle size of said circuit-forming charging powder is in the range of about 3 to 20 μm.  
     
     
         9 . The circuit-forming charging powder according to    claim 8   , wherein said adhesion reinforcing agent is at least one member selected from the group consisting of silica glass, borosilicate glass, soda lime, lead glass, aluminosilicate glass, alumina and ferrite.  
     
     
         10 . The circuit-forming charging powder according to    claim 9   , wherein said conductive metal is at least one member selected from the group consisting of copper, gold, silver, nickel, palladium or molybdenum, and wherein said charge control agent is at least one member selected from the group consisting of a metallic azo dye, a chlorinated paraffin, a chlorinated polyester, an acid-excess polyester, a sulfonylamine naphthenic acid metal salt of copper phthalocyanine, a metal salt of fatty acid and resinate soap.  
     
     
         11 . An aggregate of a plurality of circuit-forming charging powder particles according to    claim 10   .  
     
     
         12 . An aggregate of a plurality of circuit-forming charging powder particles according to    claim 1   .  
     
     
         13 . A ceramic green sheet having a circuit pattern which comprises the circuit-forming charging powder according to    claim 12    thereon.  
     
     
         14 . A ceramic green sheet having a circuit pattern which comprises the circuit-forming charging powder according to    claim 11    thereon.  
     
     
         15 . A ceramic green sheet having a circuit pattern which comprises the circuit-forming charging powder according to    claim 4    thereon.  
     
     
         16 . A ceramic green sheet having a circuit pattern which comprises the circuit-forming charging powder according to    claim 1    thereon.  
     
     
         17 . A multilayer wiring board comprising a baked laminate comprising a plurality of ceramic green sheets of    claim 16   .  
     
     
         18 . A multilayer wiring board comprising a baked laminate comprising a plurality of ceramic green sheets of    claim 15   .  
     
     
         19 . A multilayer wiring board comprising a baked laminate comprising a plurality of ceramic green sheets of    claim 14   .  
     
     
         20 . A multilayer wiring board comprising a baked laminate comprising a plurality of ceramic green sheets of    claim 13   .