Process system and process method for mounting leadframes

Abstract

The present invention comprises a process system and a process method for mounting electrical components on leadframes. An endless conveyor belt is used for this purpose, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and locked relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

We claim:  
     
         1 . A process configuration for assembly of electronic components on leadframes, comprising: 
 an endless conveyor belt;    a holder mounted on said endless conveyor belt; and    a leadframe arranged on said endless conveyor belt and adjusted relative to said holder.    
     
     
         2 . The process configuration according to    claim 1   , which comprises a temperature chamber, and wherein at least a portion of said conveyor belt is disposed in said temperature chamber.  
     
     
         3 . The process configuration according to    claim 1   , wherein said leadframe has a hole formed therein for attaching to said holder.  
     
     
         4 . The process configuration according to    claim 1   , wherein said leadframe is formed with a hole configured to enable an adjustment of said holder relative to said leadframe.  
     
     
         5 . The process configuration according to    claim 1   , wherein the process step for connecting the leadframe to a component is arranged on the conveyor belt.  
     
     
         6 . The process configuration according to    claim 1   , which comprises a device disposed at said conveyor belt for making electrical contact between said leadframe and a component.  
     
     
         7 . The process configuration according to    claim 1   , wherein said holder is a pin and said leadframe is plugged onto said pin.  
     
     
         8 . An assembly process, which comprises the following steps: 
 providing a process configuration having an endless conveyor belt and a holder attached to the endless conveyor belt; and    placing a leadframe on the conveyor belt and adjusting the leadframe relative to the holder.    
     
     
         9 . The process according to    claim 8   , which comprises causing the conveyor belt, together with the leadframe placed thereon, to pass through a temperature chamber.  
     
     
         10 . The process according to    claim 9   , which further comprises mounting a connector on the leadframe.  
     
     
         11 . The process according to    claim 10   , which comprises connecting a component to the leadframe via the connector in the temperature chamber.  
     
     
         12 . The process according to    claim 9   , which further comprises mounting solder on the leadframe prior to passing the leadframe through the temperature chamber.  
     
     
         13 . The process according to    claim 12   , which comprises soldering a component to the leadframe in the temperature chamber.  
     
     
         14 . The process according to    claim 8   , which comprises moving the conveyor belt through a freely variable distance.  
     
     
         15 . The process according to    claim 8   , which comprises electrically connecting the leadframe to a component.  
     
     
         16 . The process according to    claim 8   , wherein the leadframe is formed with a hole, and which comprises attaching the leadframe to the holder via the hole.  
     
     
         17 . The process according to    claim 8   , wherein the leadframe is formed with a hole, and which comprises adjusting the holder relative to the hole.