US2001016462A1PendingUtilityA1

Wire bonding method and apparatus

33
Assignee: IBMPriority: Jul 1, 1999Filed: Apr 9, 2001Published: Aug 23, 2001
Est. expiryJul 1, 2019(expired)· nominal 20-yr term from priority
Inventors:Douglas E. ChrzanowskiJohn A. WelshJames Warren WilsonJeffrey Zimmerman
H10W 72/5522H10W 72/5363H10W 72/075H10W 72/07141H10W 72/5525H10W 70/695H10W 70/68Y10T428/193Y10T442/60Y10T442/2164Y10T442/2197
33
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A process and apparatus are described for wire bonding circuit devices of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit device. The circuit device, or pad, is supported upon a closed woven, fiberglass mesh, which supports the circuit device during the bonding process.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A laminate support used in the process of wire bonding a circuit device, comprising a closed woven mesh having strands whose separation distance is equal to or less than the diameter of said wire of said circuit device.  
     
     
         2 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 1   , wherein said separation distance is no greater than 0.7 mils.  
     
     
         3 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 1   , wherein said separation distance is between 0.2 and 0.7 mils.  
     
     
         4 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 1   , wherein said laminate support comprises fiberglass.  
     
     
         5 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 1   , wherein said laminate support is between approximately 2.5 and 4 mils thick.  
     
     
         6 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 1   , wherein said circuit device is a pad of large scale integrated design.  
     
     
         7 . A laminate support used in the process of wire bonding a circuit device, comprising a closed woven mesh having warp and weave strands, whose separation distance is equal to or less than the thickness of said wire of said circuit device, as measured lengthwise through said closed woven mesh.  
     
     
         8 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 7   , wherein said separation distance is equal to or less than 0.7 mils.  
     
     
         9 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 7   , wherein said separation distance is between 0.2 and 0.7 mils.  
     
     
         10 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 7   , wherein said laminate support comprises fiberglass.  
     
     
         11 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 7   , wherein said laminate support is between approximately 2.5 and 4 mils thick.  
     
     
         12 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 7   , wherein said circuit device comprises a pad of large scale integrated design.  
     
     
         13 . A laminate support used in the process of wire bonding a circuit device, comprising a closed woven mesh having warp and weave strands, whose separation distance is no greater than the diameter of said wire of said circuit device as measured lengthwise through said closed woven mesh, and wherein said separation distance is approximately equal to or less than 0.7 mils.  
     
     
         14 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 13   , wherein said separation distance is between 0.2 and 0.7 mils.  
     
     
         15 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 13   , wherein said laminate support comprises fiberglass.  
     
     
         16 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 13   , wherein said laminate support is between approximately 2.5 and 4 mils thick.  
     
     
         17 . The laminate support used in the process of wire bonding a circuit device in accordance with    claim 13   , wherein said circuit device comprises a pad of large scale integrated design.  
     
     
         18 . A method for supporting a circuit device during wire bonding, comprising the steps of: 
 a) applying a capillary tool to wire that is to be bonded to a circuit device; and    b) supporting said circuit device upon a closed woven mesh whose separation distance between woven strands is less than or equal to a diameter of said wire.    
     
     
         19 . The method of    claim 18   , wherein said separation distance is approximately equal to or less than 0.7 mils.  
     
     
         20 . The method of    claim 18   , wherein said separation distance is between approximately 0.2 and 0.7 mils.

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