Primed substrate for manufacture of a printed circuit board

Abstract

A primed substrate for manufacture of a printed circuit board. At least part of the substrate is coated with a film formed by contacting a solution containing at least one film forming amine and enough acid to produce a pH of less than about 6.5. The film promotes adhesion of subsequently applied layers by inhibiting substrate oxidation and catalytic polymerization of monomers and polymers at the interface between the substrate and a resist surface by resisting resist contact with the substrate. The film enhances resist adhesion to alloys, copper, or other materials. The acid can be an organic acid, an inorganic acid, or a combination.

What is claimed is:  
     
         1 . A primed substrate for manufacture of a printed circuit board, said substrate being coated on at least a portion thereof with a film formed by contacting a solution with said substrate, said solution comprising from about 0.003% to about 3.0% of at least one film forming amine and sufficient acid to produce a pH of less than about 6.5.  
     
     
         2 . The substrate of    claim 1   , wherein the film primes copper innerlayers and flexible composites.  
     
     
         3 . The substrate of    claim 1   , wherein the film reduces priming of the substrate to a coating with a single solution.  
     
     
         4 . The substrate of    claim 1   , wherein the film promotes adhesion by inhibiting oxidation and the catalytic polymerization of monomers and polymers at an interface between the substrate and a resist surface by resisting resist contact with the substrate.  
     
     
         5 . The substrate of    claim 1   , wherein the substrate maintains a resist flexibility such that flexing reduces or eliminates cracking, crazing, or flaking of the resist coating.  
     
     
         6 . The substrate of    claim 1   , wherein the film enhances resist adhesion to alloys.  
     
     
         7 . The substrate of    claim 1   , wherein the film enhances resist adhesion to copper.  
     
     
         8 . The substrate of    claim 1   , wherein said substrate being coated is negatively charged.  
     
     
         9 . The substrate of    claim 1   , wherein the acid is selected from the group consisting of an inorganic acid, an organic acid, and a combination thereof.  
     
     
         10 . The substrate of    claim 1   , wherein the acid is selected from the group consisting of phosphoric, hydroxyacetic, hydrochloric, sulfuric, sulfamic, formic, malonic, succinic, aspartic, malic, acetic, citric, nitric, methane sulfonic, gallic, maleic, and fumaric acids.  
     
     
         11 . The substrate of    claim 1   , wherein the acid is a combination of acids.  
     
     
         12 . The substrate of    claim 1   , wherein said film forming amine is selected from the group consisting of fatty acid amines, long chain alkylamines, and amino methacrylates.  
     
     
         13 . The substrate of    claim 1   , wherein said film forming amine is selected from the group consisting of primary amines, secondary amines, tertiary amines, quaternary amines, alkylamines, C-8 through C-22 amines, basic mono cyclic tertiary amines, stabilized alietylamines, diaminopropanes, dehydroabietylamines, and ethoxylates, salts, and adducts thereof.  
     
     
         14 . The substrate of    claim 1   , wherein said solution comprises a plurality of film forming amines.