Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate

Abstract

In a substrate on which a ball grid allay type electrical part is mounted includes a substrate body, a normal land, an integrated land and a connection reinforcement section. The substrate body provided with a ball grid allay type electrical part. On the normal land, a normal electrode of the ball grid array type electrical part is connected. On the integrated land, a plurality of integrated electrodes of the ball grid allay type electrical part is connected. The connection reinforcement section connects to the integrated land to the substrate body

What is claimed is:  
     
         1 . A substrate on which a ball grid allay type electrical part is mounted comprising: 
 a substrate body provided with a ball grid allay type electrical part;    a normal land connected to a normal electrode of the ball grid array type electrical part;    an integrated land connected to a plurality of integrated electrodes of the ball grid allay type electrical part; and    a connection reinforcement section reinforcing connection of the integrated land to the substrate body.    
     
     
         2 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the connection reinforcement section is a through section which pierces the integrated land and the substrate body.    
     
     
         3 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the connection reinforcement section is a convexity section which passes through the integrated land to inside of the substrate body.    
     
     
         4 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the integrated land has a surface area which is wider than a surface area of the normal land.    
     
     
         5 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the integrated land is a grounding land supplying a ground potential.    
     
     
         6 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the integrated land is a power supply land supplying a power potential.    
     
     
         7 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the integrated land is a signal land supplying a data signal.    
     
     
         8 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the connection reinforcement section is a through pipe which pierces the integrated land and the substrate body from a front surface of the substrate body to a rear surface thereof.    
     
     
         9 . A substrate on which a ball grid allay type electrical part is mounted as claimed in    claim 1   , 
 wherein the connection reinforcement section is a retiring shape section which pierces the integrated land and is embedded in the substrate body.    
     
     
         10 . A method of mounting ball grid array type electrical part to substrate comprising: 
 connecting a normal electrode of a ball grid array type electrical part to a normal land via a connecting material; and    connecting a plurality of integrated terminals of the ball grid array type electrical part to an integrated land which is connected to a substrate body by a connection reinforcement section.    
     
     
         11 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein the connecting material is made of a solder.    
     
     
         12 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein the connection reinforcement section has a through pipe which pierces the integrated land and the substrate body; and    the connecting material is flowed into the through pipe.    
     
     
         13 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein the connection reinforcement section has a retiring shape section which pass through the integrated land to inside of the substrate body; and    the connecting material is flowed into the reinforcement section.    
     
     
         14 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein a surface area of the integrated land is wider than a surface area of the normal land.    
     
     
         15 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein a ground potential for the ball grid array type electrical part is supplied to the integrated land.    
     
     
         16 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein a power potential for the ball grid array type electrical part is supplied to the integrated land.    
     
     
         17 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein a data signal for the ball grid array type electrical part is supplied to the integrated land.    
     
     
         18 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein the connection reinforcement section is a through pipe which pierces the integrated land and the substrate body from a front surface of the substrate body to a rear surface thereof.    
     
     
         19 . A method of mounting ball grid array type electrical part on substrate as claimed in    claim 10   , 
 wherein the connection reinforcement section is a retiring shape section which pierces the integrated land and is embedded in the substrate body.