Accommodation container, accommodation container for accommodating semiconductor devices and method of carrying semiconductor devices

Abstract

An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.

What is claimed is:  
     
         1 . A container comprising: 
 at least one first container body and at least one second container body which can be stacked onto said at least one first container body, respectively, and    at least one accommodation part provided between said at least one first container body and said at least one second container body, said accommodation part being capable of accommodating a device having a plurality of terminals,    said accommodation part being made of a soft material at least at a portion to be in contact with said terminals of the device.    
     
     
         2 . An accommodation container comprising: 
 at least one first container body and at least one second container body which can be stacked onto said at least one first container body, respectively, and    at least one accommodation part provided between said at least one first container body and said at least one second container body, said accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals,    said accommodation part being made of a soft material at least at a portion to be in contact with said external terminals of the semiconductor device.    
     
     
         3 . The accommodation container as claimed in    claim 2   , 
 wherein said first container body and said second container body are entirely made of a soft material which is softer than said external connection terminals.    
     
     
         4 . The accommodation container as claimed in    claim 3   , wherein said soft material is urethane.  
     
     
         5 . The accommodation container as claimed in    claim 2   , 
 wherein said first container body includes a first outer hard portion formed at an outer part by a hard material and a first inner soft portion formed at an inner part adjacent to the accommodation part by a soft material, and    said second container body includes a second outer hard portion formed at an outer part by a hard material and a second inner soft portion formed at an inner part adjacent to the accommodation part by a soft material.    
     
     
         6 . The accommodation container as claimed in    claim 5   , 
 wherein said first outer hard portion and said first inner soft portion are formed integrally, and    said second outer hard portion and said second inner soft portion are formed integrally.    
     
     
         7 . The accommodation container as claimed in    claim 2   , 
 wherein said first container body and said second container body can be separated at a level below a height of said semiconductor device in an accommodated state.    
     
     
         8 . The accommodation container as claimed in    claim 2   , 
 wherein said first container body and said second container body are made of members having an identical shape, each of said members having at least one upper accommodation part half body on its lower surface and at least one lower accommodation part half body on its upper surface, a plurality of said members being stackable.    
     
     
         9 . The accommodation container as claimed in    claim 2   , 
 wherein said at least one accommodating part is defined by fence members provided between said first container body and said second container body.    
     
     
         10 . The accommodation container as claimed in    claim 9   , 
 wherein said second container body is provided with fence portions for holding said fence members.    
     
     
         11 . A container comprising: 
 a plurality of container bodies; and    at least one accommodation part provided between said container bodies, said accommodation part being capable of accommodating a device having a plurality of terminals,    said accommodation part being provided with a plurality of protruded portions and a plurality of terminal accommodating portions formed between said protruded portions, said protruded portions being in contact with a bottom surface of a device housing at positions between said terminals, said device being supported such that said terminals and a lower one of said container bodies are not in contact, and    a distance (E) between said terminal and said protruded portion being greater than a distance (D) between said device housing and said accommodating part (E>D).    
     
     
         12 . An accommodation container comprising: 
 a plurality of container bodies; and    at least one accommodation part provided between said container bodies, said accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals,    said accommodation part being provided with a plurality of protruded portions and a plurality of terminal accommodating portions formed between said protruded portions, said protruded portions being in contact with a bottom surface of a semiconductor device main body at positions between said external connection terminals, said semiconductor device being supported such that said external connection terminals and a lower one of said container bodies are not in contact, and    a distance (E) between said external connection terminal and said protruded portion being greater than a distance (D) between said semiconductor device main body and said accommodating part (E>D).    
     
     
         13 . The accommodation container as claimed in    claim 12   , 
 wherein said terminal accommodating portions are configured so as to correspond to the shape of said external connection terminals.    
     
     
         14 . The accommodation container as claimed in    claim 12   , 
 wherein said terminal accommodating portions penetrate through said container body and are open to an exterior environment.    
     
     
         15 . The accommodation container as claimed in    claim 12   , wherein said plurality of container bodies are stackable.  
     
     
         16 . A method of carrying semiconductor devices using an accommodation container having at least one first container body and at least one second container body which can be stacked onto said at least one first container body, respectively, and at least one accommodation part provided between said at least one first container body and said at least one second container body, said accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals, 
 wherein said accommodation part is made of a soft material at least at a portion to be in contact with said external connection terminals of the semiconductor device.    
     
     
         17 . A method of carrying semiconductor devices using an accommodation container having a plurality of container bodies and at least one accommodation part provided between said container bodies, 
 wherein said semiconductor devices are accommodated in said accommodation parts, said accommodation part being provided with a plurality of protruded portions and a plurality of terminal accommodating portions formed between said protruded portions, said protruded portions being in contact with a bottom surface of a semiconductor device main body at positions between external connection terminals of said semiconductor device, said semiconductor device being supported such that said external connection terminals and a lower one of said container bodies are not in contact, and    a distance (E) between said external connection terminal and said protruded portion being greater than a distance (D) between said semiconductor device main body and said accommodating part (E>D)