US2001036420A1PendingUtilityA1

Tin-silver based soldering alloy utility

Assignee: MITSUI MINING & SMELTING COPriority: Sep 7, 1999Filed: Jun 5, 2001Published: Nov 1, 2001
Est. expirySep 7, 2019(expired)· nominal 20-yr term from priority
B23K 35/262C22C 13/00
33
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A tin-silver-based soldering alloy, comprises 3.0 to 4.0% by weight of Ag, 6.05 to 10.0% by weight of In, 2.0 to 5.95% by weight of Bi, and the balance being Sn, wherein In+Bi≦12.0% by weight.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A tin-silver-based soldering alloy, comprising 3.0 to 4.0% by weight of Ag, 6.05 to 10.0% by weight of In, 2.0 to 5.95% by weight of Bi, and the balance being Sn, wherein In+Bi≦12.0% by weight.  
     
     
         2 . The tin-silver-based soldering alloy according to    claim 1   , wherein the In content is 6.2 to 10.0% by weight.

Join the waitlist — get patent alerts

Track US2001036420A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.