US2001036420A1PendingUtilityA1
Tin-silver based soldering alloy utility
Est. expirySep 7, 2019(expired)· nominal 20-yr term from priority
B23K 35/262C22C 13/00
33
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Claims
Abstract
A tin-silver-based soldering alloy, comprises 3.0 to 4.0% by weight of Ag, 6.05 to 10.0% by weight of In, 2.0 to 5.95% by weight of Bi, and the balance being Sn, wherein In+Bi≦12.0% by weight.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A tin-silver-based soldering alloy, comprising 3.0 to 4.0% by weight of Ag, 6.05 to 10.0% by weight of In, 2.0 to 5.95% by weight of Bi, and the balance being Sn, wherein In+Bi≦12.0% by weight.
2 . The tin-silver-based soldering alloy according to claim 1 , wherein the In content is 6.2 to 10.0% by weight.Join the waitlist — get patent alerts
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