Semiconductor element-mounting board and semiconductor device

Abstract

A semiconductor mounting board include a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

What is claimed is:  
     
         1 . In a method for manufacturing a semiconductor element-mounting board, 
 the semiconductor element-mounting board comprising a base member which includes a semiconductor element-mounting face to which a semiconductor element is mounted and electrically connected by a flip-chip mounting method and a circuit board-mounting face opposite to the semiconductor element-mounting face and mounted to a circuit board, and is formed of an electrically insulating resin material in one layer, and conductive members which are nearly orthogonal to the semiconductor element-mounting face and the circuit board-mounting face and extend linearly penetrating an interior of the base member thereby to electrically connect the semiconductor element with the circuit board,    the method comprising: 
 arranging the conductive members in a mold; and  
 thereafter, injecting the resin material for forming the base member into the mold, so that the conductive members and the resin material are integrally molded.  
   
     
     
         2 . A manufacturing method according to    claim 1   , further comprising, after the injecting, forming a wiring to be electrically connected with the conductive member, on the semiconductor element-mounting face and the circuit board-mounting face of the base member.  
     
     
         3 . A manufacturing method according to    claim 2   , further comprising machining an outer face of the base member after the injecting and before the wiring-forming.  
     
     
         4 . A manufacturing method according to    claim 1   , further comprising, after the injecting, cutting a base member block molded by injecting the resin material into the mold with the conductive member arranged therein, in a direction orthogonal to axial directions of the conductive members, and thereby obtaining the base member.  
     
     
         5 . A manufacturing method according to    claim 1   , further comprising turning rough contact faces between the conductive members and the resin material to increase adhering forces therebetween before the conductive members are set in the mold for the injecting.  
     
     
         6 . A manufacturing method according to    claim 5   , further comprising applying an adhesion-increasing agent to the contact faces in place of the turning the faces rough.  
     
     
         7 . A manufacturing method according to    claim 1   , wherein in the injecting, the resin material is injected to flow in the axial directions of the conductive members through at least two injection openings formed symmetric to each other with respect to each of the conductive members.  
     
     
         8 . A manufacturing method according to    claim 7   , wherein when the mold has a first holding plate holding axial one ends of the conductive members and having the injection openings extending in the axial directions of the conductive members, a second holding plate holding the other ends of the conductive members and rendered movable in the axial directions, and a pressure regulation mechanism allowing the second holding plate to move in the axial directions in response to the compression/extension of the conductive members due to the injected resin material, 
 in the injecting, the second holding plate is moved in the axial directions in response to the compression/extension of the conductive members due to the injected resin material, thereby restricting bend in the conductive members.    
     
     
         9 . A manufacturing method according to    claim 1   , wherein in the injecting, the resin material flows in the axial directions of the conductive members after being injected to a vicinity of the axial one ends of the conductive members through a plurality of injection openings formed in the vicinity of the axial one ends of the conductive members supported by the mold.  
     
     
         10 . In a method for manufacturing a semiconductor element-mounting board, 
 the semiconductor element-mounting board comprising a base member which includes a semiconductor element-mounting face to which a semiconductor element is mounted and electrically connected by a flip-chip mounting method and a circuit board-mounting face opposite to the semiconductor element-mounting face and mounted to a circuit board, and is formed of an electrically insulating resin material in one layer, and conductive members which are nearly orthogonal to the semiconductor element-mounting face and the circuit board-mounting face and extend linearly penetrating an interior of the base member thereby to electrically connect the semiconductor element with the circuit board,    the method comprising: 
 injecting the resin material into the mold so that through holes are formed to penetrate the semiconductor element-mounting face and the circuit board-mounting face to mold the base member; and  
 inserting the conductive members in the through holes.  
   
     
     
         11 . A manufacturing method according to    claim 10   , further comprising, after the inserting the conductive members into the through holes, forming a wiring to the semiconductor element-mounting face, the circuit board-mounting face of the base member, and an inner wall face of one of the through holes.  
     
     
         12 . A manufacturing method according to    claim 10   , further comprising, after the injecting, cutting a molded base member block provided with the through holes in a direction orthogonal to an extending direction of the through holes to form the base member.  
     
     
         13 . A manufacturing method according to    claim 1   , further comprising: 
 after the injecting, forming at the conductive member a projecting part projecting from the circuit board-mounting face; and    performing plastic treatment on the projecting part so as to form a land to be connected to the circuit board.    
     
     
         14 . A manufacturing method according to    claim 10   , further comprising: 
 after the injecting, forming at the conductive member a projecting part projecting from the circuit board-mounting face; and    performing plastic treatment on the projecting part so as to form a land to be connected to the circuit board.    
     
     
         15 . A manufacturing method according to    claim 13   , wherein in the forming the projecting part, the method comprise: 
 leveling the base member with the conductive member so that a thickness of the base member is equal to a length of the conductive member; and    thereafter, removing only the base member in a thicknesswise direction.    
     
     
         16 . A manufacturing method according to    claim 14   , wherein in the forming the projecting part, the method comprise: 
 leveling the base member with the conductive member so that a thickness of the base member is equal to a length of the conductive member; and    thereafter, removing only the base member in a thicknesswise direction.    
     
     
         17 . A manufacturing method according to    claim 15   , wherein the removing of the base member is conducted by any of wet etching, dry etching, sandblasting, and machining.  
     
     
         18 . A manufacturing method according to    claim 16   , wherein the removing of the base member is conducted by any of wet etching, dry etching, sandblasting, and machining.  
     
     
         19 . A manufacturing method according to    claim 2   , wherein the wiring is obtained by forming the wiring by etching after plating a conductor on the base member, or by plating only a necessary part to be wired.  
     
     
         20 . A manufacturing method according to    claim 11   , wherein the wiring is obtained by forming the wiring by etching after plating a conductor on the base member, or by plating only a necessary part to be wired.  
     
     
         21 . A manufacturing method according to    claim 2   , wherein the wiring is obtained by printing and heating a conductive paste on the base member.  
     
     
         22 . A manufacturing method according to    claim 11   , wherein the wiring is obtained by printing and heating a conductive paste on the base member.  
     
     
         23 . A method for manufacturing a semiconductor device, the method comprising: 
 mounting and electrically connecting a plurality of semiconductor elements to a semiconductor element-mounting face of a semiconductor element-mounting board which includes: 
 a base member which includes a semiconductor element-mounting face to which a semiconductor element is mounted and electrically connected by a flip-chip mounting method and a circuit board-mounting face opposite to the semiconductor element-mounting face and mounted to a circuit board, and which is formed of an electrically insulating resin material in one layer; and  
 conductive members which are nearly orthogonal to the semiconductor element-mounting face and the circuit board-mounting face and extend linearly penetrating an interior of the base member thereby to electrically connect the semiconductor element with the circuit board;  
   sealing the plurality of mounted semiconductor elements simultaneously by means of a sealing resin; and    cutting the semiconductor element-mounting board and the sealing resin at between the semiconductor elements.