Channel connection for pipe to block joints

Abstract

A heat sink assembly having a heat plate with a channel formed therein which is accessible through a surface of the heat plate via a slot. A heat pipe is disposed in the channel and is bound to the heat plate with a bonding material disposed through the slot and into the channel.

What is claimed is:  
     
         1 . A heat transfer assembly, comprising: 
 a heat plate having a channel defined by a channel wall, said channel having a cross-section, said heat plate having a slot formed in a surface of the heat plate, said slot extending into said channel substantially along a length of said channel;    a heat pipe having an outer surface, a cross-section, and dimensioned for receipt in said channel so that a gap is formed between said pipe outer surface and said channel wall, said pipe cross-section being larger than a width of said slot for preventing removal of said heat pipe from said channel when said pipe is moved in a perpendicular direction relative to said channel length; and    a bonding material disposed in said gap through said slot, said bonding material securing said heat pipe to said heat plate and providing thermal coupling therebetween.    
     
     
         2 . The heat transfer assembly of    claim 1   , wherein said channel cross-section has the shape of one of: substantially a circle, substantially an ellipse, and substantially an oval.  
     
     
         3 . The heat transfer assembly of    claim 1   , wherein said pipe cross-section has the shape of one of: substantially a circle, substantially an ellipse, and substantially an oval.  
     
     
         4 . The heat transfer assembly of    claim 2   , wherein said pipe cross-section has the shape of one of substantially a circle, substantially an ellipse, and substantially an oval.  
     
     
         5 . The heat transfer assembly of    claim 1   , wherein said bonding material is one of solder paste, solder epoxy, and adhesive.  
     
     
         6 . The heat transfer assembly of    claim 1   , wherein the bonding material substantially fills said gap.  
     
     
         7 . A method of forming a heat transfer assembly, comprising the steps of: 
 providing a heat plate having a surface;    forming a channel in said heat plate, said channel having a cross-section and a length;    forming a slot in the surface of said heat plate substantially along the length of said channel, said slot having a width less than the cross-section of said channel and extending into said channel for providing access to said channel through said heat plate surface;    inserting a heat pipe into said channel along at least a portion of said channel length, said pipe dimensioned for forming a gap between an outer surface of said pipe and a wall defining said channel; and    disposing a heat conducting adhesive material into said gap by accessing said gap through said slot, for thermally coupling said pipe to said heat plate.    
     
     
         8 . The heat transfer assembly forming method of    claim 7   , further comprising the step of: 
 heating the heat transfer assembly to cause said heat conducting adhesive to flow into and substantially fill said gap.    
     
     
         9 . The heat transfer assembly forming method of    claim 7   , wherein said channel cross-section has the shape of one of: substantially a circle, substantially an ellipse, and substantially an oval.  
     
     
         10 . The heat transfer assembly forming method of    claim 7   , wherein said pipe cross-section has the shape of one of: substantially a circle, substantially an ellipse, and substantially an oval.  
     
     
         11 . The heat transfer assembly forming method of    claim 9   , wherein said pipe cross-section has the shape of one of substantially a circle, substantially an ellipse, and substantially an oval.  
     
     
         12 . The heat transfer assembly forming method of    claim 7   , wherein said heat conducting adhesive material is one of solder paste, solder epoxy, and adhesive.  
     
     
         13 . The heat transfer assembly forming method of    claim 7   , wherein the heat conducting adhesive material substantially fills said gap.