Water-permeable adhesive tape

Abstract

The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

1 . A water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials, comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%.  
     
     
         2 . The water-permeable adhesive tape according to    claim 1   , wherein the base film comprises a synthetic resin or a non-woven fabric.  
     
     
         3 . The water-permeable adhesive tape according to    claim 1    or    2   , wherein the size of the perforations is from 0.001 to 3.0 mm 2 .  
     
     
         4 . The water-permeable adhesive tape according to any of    claims 1    to    3   , wherein the adhesive comprises a rubber- or acrylic-based adhesive.  
     
     
         5 . The water-permeable adhesive tape according to any of    claims 1    to    4   , wherein the adhesive is pressure-sensitive, light-sensitive and/or heat-sensitive.  
     
     
         6 . The water-permeable adhesive tape according to any of    claims 1    to    5   , having an elongation of more than 10%.  
     
     
         7 . The water-permeable adhesive tape according to any of    claims 1    to    6   , having a tensile strength of more than 0.1 N/20 mm.  
     
     
         8 . The water-permeable adhesive tape according to any of    claims 1    to    7   , having an adhesive strength of 0.15 to 10 N/20 mm.