Bonding member and gypsum board mounting method using the same

Abstract

A bonding member 1 comprising a metallic plate 2 formed as a small piece onto which a hot melt adhesive layer 3 is formed at least one side of said metallic plate 2 , and a gypsum board mounting method for mounting a gypsum board 5 using the bonding member 1 , comprising: fixing said bonding member 5 temporarily; pushing said gypsum board 5 , heating the metallic plate 2 with electromagnetic induction to melt said hot melt adhesive layer 3 ; and thereby allowing the gypsum board 5 to be bonded easily without noise. The bonded gypsum board 5 can be recycled because it can be peeled off easily with melting the adhesive layer 3 without damage of the board.

What is claimed is:  
     
         1 . A bonding member comprising a metallic plate formed as a small piece onto which a hot melt adhesive layer is formed at least one side of said metallic plate.  
     
     
         2 . A bonding member according to  claim 1 , characterized in that said bonding member is disposed between a gypsum board and a pillar, and said metallic plate is heated with electromagnetic induction from the surface side of said gypsum board to melt said hot melt adhesive layer, whereby the metallic plate is bonded to at least said gypsum board or said pillar.  
     
     
         3 . A bonding member according to  claim 1 , characterized in that said metallic plate is provided with an inserting projection for fixing the bonding member temporarily to a portion to which the gypsum board is to be mounted.  
     
     
         4 . A bonding member according to  claim 3 , characterized in that said metallic plate is provided with a pair of holding plate portions for allowing the bonding member to be held by and temporarily fixed to said pillar.  
     
     
         5 . A bonding member according to  claim 1 , characterized in that said metallic plate is magnetized.  
     
     
         6 . A gypsum board mounting method for mounting the gypsum board to a portion where said gypsum board is to be mounted using a bonding member comprising a metallic plate formed as a small piece onto which a hot melt adhesive layer is formed at least one side of said metallic plate, characterized in that said method comprising: fixing said bonding member temporarily to said portion; pushing said gypsum board onto said bonding member; heating said metallic plate of the bonding member with electromagnetic induction from above said gypsum board to melt said hot melt adhesive layer; and thereby allowing the gypsum board to be bonded to said portion.  
     
     
         7 . A gypsum board mounting method according to  claim 6 , characterized in that said temporary fixing is performed while at least a top bonding member out of plural bonding members interconnected with an elongated member is fastened to said portion to which the gypsum board is to be mounted.  
     
     
         8 . A gypsum board mounting method according to  claim 6 , characterized in that said temporary fixing is performed with driving an inserting member into said portion to which the gypsum board is to be mounted, so as to pierce through the bonding member.  
     
     
         9 . A gypsum board mounting method according to  claim 6 , characterized in that said temporary fixing is performed with adhesively bonding together said bonding member and said portion to which the gypsum board is to be mounted, while interposing a double-side coated adhesive tape between said bonding member and said portion, said double-side coated adhesive tape being smaller than said hot melt adhesive layer.  
     
     
         10 . A gypsum board mounting method according to  claim 6 , characterized in that said method further comprising: detecting said metallic plate by a metal detecting means from above said gypsum board; and then heating the metallic plate with electromagnetic induction at the position where the metallic plate is detected by said metal detecting means.  
     
     
         11 . A gypsum board mounting method according to  claim 10 , characterized in that said metal detecting means utilizes an electromagnetic induction heater for heating said metallic plate.  
     
     
         12 . A building dismantlement method for dismantling a building to which gypsum boards have been mounted by a method using a bonding member comprising a metallic plate formed as a small piece onto which a hot melt adhesive layer is formed at least one side of said metallic plate, characterized in that said mounting method comprising: 
 fixing said bonding member temporarily to said portion; pushing said gypsum board onto said bonding member;    heating said metallic plate of the bonding member with electromagnetic induction from above said gypsum board to melt said hot melt adhesive layer; and    thereby allowing the gypsum board to be bonded to said portion, wherein said dismantlement method comprising: 
 heating said metallic plate by an electromagnetic induction heating means;  
 melting said hot melt adhesive layer; and  
 removing said gypsum board from its mounted portion.  
   
     
     
         13 . A building dismantlement method according to  claim 12 , characterized in that said method further comprising: detecting said metallic plate by a metal detecting means from above said gypsum board; and heating the metallic plate by said electromagnetic induction heating means at the position where the metallic plate is detected by said metal detecting means.  
     
     
         14 . A building dismantlement method according to  claim 13 , characterized in that said metallic plate is detected by said electromagnetic induction heating means.