Cooling system for multichip module

Abstract

It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.

1 . A cooling system for cooling a multichip module, having a predetermined function, on the substrate of which a plurality of electronic parts including heat generating parts are mounted, the cooling system for cooling a multichip module comprising: 
 a radiating body capable of covering the upper portions of the plurality of electronic parts while a predetermined clearance is formed between the radiating body and the electronic parts;    a heat conducting member arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and    a fastening body for detachably connecting the radiating body with the substrate of the multichip module.    
     
     
         2 . The cooling system for cooling a multichip module according to  claim 1 , wherein the fastening body includes at least one screw.  
     
     
         3 . The cooling system for cooling a multichip module according to  claim 2 , wherein at least one screw is screwed to a corresponding stud perpendicularly arranged on the substrate.  
     
     
         4 . The cooling system for cooling a multichip module according to  claim 1 , wherein the fastening body includes an elastic frame having a hook portion capable of catching the substrate so that the radiating body can be detachably fixed to the substrate while the fastening body covers the radiating body.  
     
     
         5 . The cooling system for cooling a multichip module according to  claim 1 , wherein the fastening body includes at least one C-shaped clip to pinch the radiating body and the substrate.  
     
     
         6 . The cooling system for cooling a multichip module according to  claim 1 , wherein the substrate of the multichip module is flexible.  
     
     
         7 . The cooling system for cooling a multichip module according to  claim 1 , wherein the radiating body includes a plurality of fins.  
     
     
         8 . The cooling system for cooling a multichip module according to  claim 1 , wherein a centrifugal fan is attached to an upper surface of the radiating body.  
     
     
         9 . The cooling system for cooling a multichip module according to  claim 1 , wherein the heat conducting member is made of a heat conducting grease.  
     
     
         10 . The cooling system for cooling a multichip module according to  claim 1 , wherein the heat conducting member is composed of a flexible sheet.  
     
     
         11 . A cooling system for cooling a multichip module having a predetermined function, on the substrate of which a plurality of electronic parts including heat generating parts are mounted, the cooling system for cooling a multichip module comprising: 
 a radiating body capable of covering the upper portions of the plurality of electronic parts while a predetermined clearance is formed between the radiating body and the electronic parts;    a fastening body for detachably connecting the radiating body with the substrate of the multichip module; and    an axial fan attached onto an upper surface of the radiating body, wherein the radiating body includes inlet ports for air discharged from the axial fan into the radiating body and also includes discharge ports to discharge air outside.    
     
     
         12 . The cooling system for cooling a multichip module according to  claim 11 , wherein the inlet ports of the radiating body are intensively arranged in a portion of the radiating body corresponding to a region on the substrate in which a large quantity of heat is generated.  
     
     
         13 . The cooling system for cooling a multichip module according to  claim 11 , wherein a nozzle from which air is strongly blown out to a region on the substrate in which a large quantity of heat is generated is attached to at least one inlet port of the radiating body.