Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card

Abstract

A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

What is claimed is:  
     
         1 . A semiconductor device mounting system, comprising: 
 a separator for peeling off a group of semiconductor devices, among semiconductor devices for an object obtained by dicing a semiconductor wafer adhered to a front face of an adhesive sheet, from said adhesive sheet;    a conveyor for conveying the group of semiconductor devices peeled from the adhesive sheet by said separator to a mounting position on a mounting board on a semiconductor device unit basis; and    a mounter for relatively positioning an electrode formed in a semiconductor device, of the group of semiconductor devices conveyed by said conveyor, and an electrode formed on the mounting board and mounting said semiconductor device onto the mounting board.    
     
     
         2 . A semiconductor device mounting system, comprising: 
 a separator for peeling off a group of semiconductor devices, among the semiconductor devices for an object obtained by dicing a semiconductor wafer adhered to a front face of an adhesive sheet, from said adhesive sheet in such a manner than a member having a tip in a projecting shape or a curved shape is pushed up against the back face of said adhesive sheet to thereby give tension to said adhesive sheet and said member is moved from one end of the adhesive sheet to the other end;    conveyor for conveying the group of semiconductor devices peeled from the adhesive sheet by said separator to a mounting position on a mounting board on a semiconductor device unit basis; and    a mounter for relatively positioning an electrode formed in a semiconductor device, of the group of semiconductor devices conveyed by said conveyor, and an electrode formed on the mounting board and mounting said semiconductor device onto the mounting board.    
     
     
         3 . A semiconductor device mounting system, comprising: 
 a separator for peeling off a group of semiconductor devices, among semiconductor devices for an object obtained by dicing a semiconductor wafer adhered to a front face of an adhesive sheet, from said adhesive sheet in such a manner that a member having a tip in a projecting shape or a curved shape presses the back face of said adhesive sheet to thereby give tension to said adhesive sheet and said member is moved from one end of the adhesive sheet to the other end;    a conveyor for conveying the group of semiconductor devices peeled from the adhesive sheet by said separator in a unit to a mounting position or a mounting board on a semiconductor device unit basis; and    a mounter for relatively positioning an electrode formed in a semiconductor device, of the group of semiconductor devices conveyed by said conveyor, and an electrode formed on the mounting board and mounting said semiconductor device onto the mounting board.    
     
     
         4 . A semiconductor device mounting system, comprising: 
 a separator for peeling off an adhesive sheet from semiconductor devices, among semiconductor devices for an object obtained by dicing a semiconductor wafer, adhered to a face of the adhesive sheet, by clamping an end part of said adhesive sheet and pulling said adhesive sheet at least in the direction along the face of the adhesive sheet in a state where said semiconductor devices are held by a chuck;    a conveyor for conveying the semiconductor devices from which the adhesive sheet has been peeled by said separator, to a mounting position on a mounting board on a semiconductor device unit basis; and    a mounter for relatively positioning an electrode formed in a semiconductor device, of the semiconductor devices from which the adhesive sheet has been peeled, conveyed by said conveyor, and an electrode formed on the mounting board and mounting said semiconductor device onto the mounting board.    
     
     
         5 . A semiconductor device mounting system, comprising: 
 a separator for peeling off an adhesive sheet from a group of semiconductor devices, among semiconductor devices for an object obtained by dicing a semiconductor wafer, adhered to a face of the adhesive sheet, by clamping an end of said adhesive sheet and pulling the adhesive sheet at least in the direction along the face of the adhesive sheet in a state where said group of semiconductor devices is held by a chuck;    a conveyor for conveying the group of semiconductor devices peeled from the adhesive sheet by said separating means to a mounting position on a mounting board, on a unit basis; and    a mounter for relatively positioning an electrode formed in a semiconductor device, of the semiconductor devices conveyed by said conveyor, and an electrode formed on the mounting board and mounting said semiconductor device onto the mounting board.    
     
     
         6 . A semiconductor device mounting system, comprising: 
 a separator for peeling off an adhesive sheet from a group of semiconductor devices, for an object obtained by dicing a semiconductor wafer adhered to a face of the adhesive sheet while the adhesive sheet is forming a bending shape, by clamping an end of said adhesive sheet and pulling said adhesive sheet at least in the direction along the face of the adhesive sheet in a state where said group of semiconductor devices are held by a chuck;    a conveyor for conveying the group of semiconductor devices peeled from the adhesive sheet by said separator in serial order to a mounting position on a mounting board; and    a mounter for relatively positioning an electrode formed in a semiconductor device, of the group of semiconductor devices conveyed by said conveyor, and an electrode formed on the mounting board and mounting said semiconductor device onto the mounting board.